Inventor
NAGANO MUTSUMI
JP5 patents
Patents
5 patentsUS5481798AJan 9, 1996
Etching method for forming a lead frame
SONY CORP26 citations92
US5349238ASep 20, 1994
Semiconductor device
SONY CORP41 citations92
US5812381ASep 22, 1998
Lead frame and integrated circuit package using the lead frame
SONY CORP18 citations90
US5437764AAug 1, 1995
Lead frame and manufacturing method therefor
SONY CORP6 citations73
US5937278AAug 10, 1999
Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer
SONY CORP3 citations62