Inventor
MIYAMOTO SABURO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “MIYAMOTO SABURO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
12 patentsUS5891298AApr 6, 1999
Method and apparatus for peeling protective adhesive tape from semiconductor wafer
NITTO DENKO CORP125 citations97
US5759006AJun 2, 1998
Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith
NITTO DENKO CORP74 citations95
US6235144B1May 22, 2001
Resist removing apparatus and method
NITTO DENKO CORP21 citations92
US7393757B2Jul 1, 2008
Method for separating semiconductor wafer from supporting member, and apparatus using the same
NITTO DENKO CORP10 citations82
US7384811B2Jun 10, 2008
Method of separating semiconductor wafer, and separating apparatus using the same
NITTO DENKO CORP16 citations82
US6099675AAug 8, 2000
Resist removing method
NITTO DENKO CORP8 citations73
US7387951B2Jun 17, 2008
Method of dicing semiconductor wafer into chips, and apparatus using this method
NITTO DENKO CORP3 citations63
US7849900B2Dec 14, 2010
Apparatus for joining a separating adhesive tape
NITTO DENKO CORP4 citations62
US8349106B2Jan 8, 2013
Adhesive tape joining method and adhesive tape joining apparatus
NITTO DENKO CORP1 citations51
US7078316B2Jul 18, 2006
Substrate joining apparatus
NITTO DENKO CORP1 citations50
US7984737B2Jul 26, 2011
Adhesive tape cutting method and adhesive tape joining apparatus using the same
NITTO DENKO CORP0 citations42
US7913735B2Mar 29, 2011
Adhesive tape joining apparatus
NITTO DENKO CORP0 citations42