Inventor
WOJNAROWSKI ROBERT JOHN
US46 patents
⚠️ This page may combine multiple inventors who share the name “WOJNAROWSKI ROBERT JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GEN ELECTRIC
39 patentsUS6396153B2May 28, 2002
Circuit chip package and fabrication method
GEN ELECTRIC163 citations99
US6242282B1Jun 5, 2001
Circuit chip package and fabrication method
GEN ELECTRIC198 citations99
US6046410AApr 4, 2000
Interface structures for electronic devices
GEN ELECTRIC141 citations99
US5888884AMar 30, 1999
Electronic device pad relocation, precision placement, and packaging in arrays
GEN ELECTRIC303 citations99
US5857858AJan 12, 1999
Demountable and repairable low pitch interconnect for stacked multichip modules
GEN ELECTRIC170 citations99
US5849623ADec 15, 1998
Method of forming thin film resistors on organic surfaces
GEN ELECTRIC183 citations99
US5703400ADec 30, 1997
Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
GEN ELECTRIC212 citations99
US5675310AOct 7, 1997
Thin film resistors on organic surfaces
GEN ELECTRIC165 citations99
US6412971B1Jul 2, 2002
Light source including an array of light emitting semiconductor devices and control method
GEN ELECTRIC255 citations98
US6262573B1Jul 17, 2001
Electromagnetic system for railroad track crack detection and traction enhancement
GEN ELECTRIC91 citations98
US6092280AJul 25, 2000
Flexible interface structures for electronic devices
GEN ELECTRIC97 citations98
US6002163ADec 14, 1999
Electronic device pad relocation, precision placement, and packaging in arrays
GEN ELECTRIC118 citations98
US5900674AMay 4, 1999
Interface structures for electronic devices
GEN ELECTRIC168 citations98
US6040226AMar 21, 2000
Method for fabricating a thin film inductor
GEN ELECTRIC125 citations97
US6507113B1Jan 14, 2003
Electronic interface structures and methods of fabrication
GEN ELECTRIC58 citations96
US6229203B1May 8, 2001
Semiconductor interconnect structure for high temperature applications
GEN ELECTRIC82 citations96
US5938452AAug 17, 1999
Flexible interface structures for electronic devices
GEN ELECTRIC52 citations96
US5785787AJul 28, 1998
Processing low dielectric constant materials for high speed electronics
GEN ELECTRIC52 citations96
US6298551B1Oct 9, 2001
Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas
GEN ELECTRIC79 citations95
US6239980B1May 29, 2001
Multimodule interconnect structure and process
GEN ELECTRIC91 citations95
US5949133ASep 7, 1999
Semiconductor interconnect structure for high temperature applications
GEN ELECTRIC29 citations93
US5672546ASep 30, 1997
Semiconductor interconnect method and structure for high temperature applications
GEN ELECTRIC26 citations93
US7262444B2Aug 28, 2007
Power semiconductor packaging method and structure
GEN ELECTRIC50 citations92
US6655011B1Dec 2, 2003
Method for fabricating a switch structure
GEN ELECTRIC36 citations92
US6474860B2Nov 5, 2002
Alignment of optical interfaces for data communication
GEN ELECTRIC16 citations92
US6410356B1Jun 25, 2002
Silicon carbide large area device fabrication apparatus and method
GEN ELECTRIC25 citations92
US6297459B1Oct 2, 2001
Processing low dielectric constant materials for high speed electronics
GEN ELECTRIC31 citations92
US6272271B1Aug 7, 2001
Alignment of optical interfaces for data communication
GEN ELECTRIC40 citations92
US6188301B1Feb 13, 2001
Switching structure and method of fabrication
GEN ELECTRIC42 citations92
US5872040AFeb 16, 1999
Method for fabricating a thin film capacitor
GEN ELECTRIC32 citations92
US5683928ANov 4, 1997
Method for fabricating a thin film resistor
GEN ELECTRIC43 citations92
US6720561B2Apr 13, 2004
Direct CsI scintillator coating for improved digital X-ray detector assembly longevity
GEN ELECTRIC17 citations91
US7829386B2Nov 9, 2010
Power semiconductor packaging method and structure
GEN ELECTRIC8 citations84
US7572973B2Aug 11, 2009
Method of making devices for solid state thermal transfer and power generation
GEN ELECTRIC8 citations84
US6302987B1Oct 16, 2001
High voltage polymer processing methods and power feed-through bushing applications
GEN ELECTRIC15 citations83
US7498507B2Mar 3, 2009
Device for solid state thermal transfer and power generation
GEN ELECTRIC7 citations74
US7005648B2Feb 28, 2006
Direct CsI scintillator coating for improved digital X-ray detector assembly longevity
GEN ELECTRIC3 citations62
US6603145B2Aug 5, 2003
High temperature circuit apparatus
GEN ELECTRIC1 citations52
US6429381B1Aug 6, 2002
High density interconnect multichip module stack and fabrication method
GEN ELECTRIC0 citations52
LOCKHEED CORP
5 patentsUS5866952AFeb 2, 1999
High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
LOCKHEED CORP239 citations96
US7667375B2Feb 23, 2010
Broad band energy harvesting system and related methods
LOCKHEED CORP36 citations92
US5897728AApr 27, 1999
Integrated circuit test structure and test process
LOCKHEED CORP48 citations92
US7696676B2Apr 13, 2010
Piezoelectric composite apparatus and related methods
LOCKHEED CORP1 citations50
US7482634B2Jan 27, 2009
Monolithic array for solid state ultraviolet light emitters
LOCKHEED CORP1 citations48