Inventor
BLAIS CLAUDE
CA4 patents
Patents
4 patentsUS5457299AOct 10, 1995
Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip
IBM17 citations71
US6112976ASep 5, 2000
Method of manufacturing wire segments of homogeneous composition
IBM5 citations57
US6904673B1Jun 14, 2005
Control of flux by ink stop line in chip joining
IBM6 citations54
US7771541B2Aug 10, 2010
Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces
IBM0 citations49