Inventor
DANOVITCH DAVID HIRSCH
CA11 patents
⚠️ This page may combine multiple inventors who share the name “DANOVITCH DAVID HIRSCH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS5775569AJul 7, 1998
Method for building interconnect structures by injection molded solder and structures built
IBM120 citations98
US6149122ANov 21, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM61 citations95
US6133633AOct 17, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM40 citations95
US6390439B1May 21, 2002
Hybrid molds for molten solder screening process
IBM44 citations94
US6003757ADec 21, 1999
Apparatus for transferring solder bumps and method of using
IBM81 citations93
US5897336AApr 27, 1999
Direct chip attach for low alpha emission interconnect system
IBM42 citations92
US6832747B2Dec 21, 2004
Hybrid molds for molten solder screening process
IBM18 citations91
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91
US6112976ASep 5, 2000
Method of manufacturing wire segments of homogeneous composition
IBM5 citations57