Inventor

SANKMAN ROBERT L

US133 patents

⚠️ This page may combine multiple inventors who share the name “SANKMAN ROBERT L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANKMAN ROBERT L

INTEL CORP

Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same

Electronic assembly with trench structures and methods of manufacture

Method for making high density substrate interconnect using inkjet printing

Interconnect structures with polymer core

High density substrate interconnect formed through inkjet printing

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Electronic package with high density interconnect and associated methods

Vertical electronic circuit package

Integrated circuit packages with sandwiched capacitors

Electronic assembly with sandwiched capacitors and methods of manufacture

Inorganic-based embedded-die layers for modular semiconductive devices

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

High density package interconnects

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Chip-to-chip interconnect with embedded electro-optical bridge structures

Integration of embedded thin film capacitors in package substrates

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Ultra-thin, hyper-density semiconductor packages

Surface-mount inductor structures for forming one or more inductors with substrate traces

Glass core substrate for integrated circuit devices and methods of making the same

Integrated circuits and systems and methods for producing the same

Load-dependent variable frequency voltage regulator

Multi-chip packaging

Electrical assembly with vertical multiple layer structure

Fabrication method for vertical electronic circuit package and system

Parallel plane substrate

Distributed semiconductor die and package architecture

Microelectronic device with embedded die substrate on interposer

Stacked silicon die architecture with mixed flipcip and wirebond interconnect

Antenna package using ball attach array to connect antenna and base substrates

Stacked die cavity package

Planar integrated circuit package interconnects

Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same

Planar integrated circuit package interconnects

Chip-to-chip interconnect with embedded electro-optical bridge structures

Microelectronic bond pads having integrated spring structures

High density package interconnects

Electromagnetic interference shielding for system-in-package technology

SANKMAN ROBERT L

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Integration of embedded thin film capacitors in package substrates

MALATKAR PRAMOD

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

MA QING

Glass core substrate for integrated circuit devices and methods of making the same

INTEL IP CORP

Hybrid exposure for semiconductor devices

GANESAN SANKA

High density package interconnects

ROY MIHIR K

Through mold via polymer block package

DATTAGURU SRIRAM

In-package microelectronic apparatus, and methods of using same