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Inventor
MORIOKA SHIGEKI
JP
2 patents
Patents
2 patents
US6356173B1
Mar 12, 2002
High-frequency module coupled via aperture in a ground plane
KYOCERA CORP
92 citations
96
US6057600A
May 2, 2000
Structure for mounting a high-frequency package
KYOCERA CORP
146 citations
96