Inventor
JIMAREZ MIGUEL ANGEL
US16 patents
⚠️ This page may combine multiple inventors who share the name “JIMAREZ MIGUEL ANGEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS5729440AMar 17, 1998
Solder hierarchy for chip attachment to substrates
IBM100 citations96
US6664637B2Dec 16, 2003
Flip chip C4 extension structure and process
IBM63 citations95
US6225206B1May 1, 2001
Flip chip C4 extension structure and process
IBM67 citations95
US5909838AJun 8, 1999
Method of solder removal
IBM24 citations92
US6194667B1Feb 27, 2001
Receptor pad structure for chip carriers
IBM28 citations89
US5655703AAug 12, 1997
Solder hierarchy for chip attachment to substrates
IBM14 citations72
US5810241ASep 22, 1998
Solder bonding/debonding nozzle insert
IBM7 citations69
US7270478B2Sep 18, 2007
X-ray alignment system for fabricating electronic chips
IBM2 citations62
US6223968B1May 1, 2001
Solder bonding/debonding nozzle insert
IBM2 citations58
US6082608AJul 4, 2000
Solder bonding/debonding nozzle insert
IBM1 citations58
AMKOR TECHNOLOGY INC
5 patentsUS7898093B1Mar 1, 2011
Exposed die overmolded flip chip package and fabrication method
AMKOR TECHNOLOGY INC50 citations98
US8476748B1Jul 2, 2013
Exposed die overmolded flip chip package and fabrication method
AMKOR TECHNOLOGY INC15 citations92
US8847372B1Sep 30, 2014
Exposed die overmolded flip chip package and fabrication method
AMKOR TECHNOLOGY INC8 citations84
US8541260B1Sep 24, 2013
Exposed die overmolded flip chip package and fabrication method
AMKOR TECHNOLOGY INC7 citations84
US8368194B1Feb 5, 2013
Exposed die overmolded flip chip package
AMKOR TECHNOLOGY INC8 citations84