Inventor
SMITH JOHN W
US200 patents
Patents
50 patentsUS6828668B2Dec 7, 2004
Flexible lead structures and methods of making same
TESSERA INC143 citations99
US6437240B2Aug 20, 2002
Microelectronic connections with liquid conductive elements
TESSERA INC84 citations99
US6365975B1Apr 2, 2002
Chip with internal signal routing in external element
TESSERA INC240 citations99
US6239384B1May 29, 2001
Microelectric lead structures with plural conductors
TESSERA INC234 citations99
US6228686B1May 8, 2001
Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions
TESSERA INC123 citations99
US6194291B1Feb 27, 2001
Microelectronic assemblies with multiple leads
TESSERA INC182 citations99
US6130116AOct 10, 2000
Method of encapsulating a microelectronic assembly utilizing a barrier
TESSERA INC148 citations99
US6117694ASep 12, 2000
Flexible lead structures and methods of making same
TESSERA INC219 citations99
US6030856AFeb 29, 2000
Bondable compliant pads for packaging of a semiconductor chip and method therefor
TESSERA INC127 citations99
US6012224AJan 11, 2000
Method of forming compliant microelectronic mounting device
TESSERA INC157 citations99
US5989936ANov 23, 1999
Microelectronic assembly fabrication with terminal formation from a conductive layer
TESSERA INC215 citations99
US5980270ANov 9, 1999
Soldering with resilient contacts
TESSERA INC249 citations99
US5929517AJul 27, 1999
Compliant integrated circuit package and method of fabricating the same
TESSERA INC185 citations99
US5812378ASep 22, 1998
Microelectronic connector for engaging bump leads
TESSERA INC239 citations99
US5808874ASep 15, 1998
Microelectronic connections with liquid conductive elements
TESSERA INC147 citations99
US5802699ASep 8, 1998
Methods of assembling microelectronic assembly with socket for engaging bump leads
TESSERA INC434 citations99
US5801441ASep 1, 1998
Microelectronic mounting with multiple lead deformation and bonding
TESSERA INC245 citations99
US5776796AJul 7, 1998
Method of encapsulating a semiconductor package
TESSERA INC173 citations99
US5706174AJan 6, 1998
Compliant microelectrionic mounting device
TESSERA INC142 citations99
US5659952AAug 26, 1997
Method of fabricating compliant interface for semiconductor chip
TESSERA INC491 citations99
US5615824AApr 1, 1997
Soldering with resilient contacts
TESSERA INC217 citations99
US5590460AJan 7, 1997
Method of making multilayer circuit
TESSERA INC172 citations99
US5518964AMay 21, 1996
Microelectronic mounting with multiple lead deformation and bonding
TESSERA INC659 citations99
US6848173B2Feb 1, 2005
Microelectric packages having deformed bonded leads and methods therefor
TESSERA INC82 citations98
US6603209B1Aug 5, 2003
Compliant integrated circuit package
TESSERA INC96 citations98
US6586955B2Jul 1, 2003
Methods and structures for electronic probing arrays
TESSERA INC137 citations98
US6359335B1Mar 19, 2002
Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
TESSERA INC113 citations98
US6232152B1May 15, 2001
Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
TESSERA INC131 citations98
US6205660B1Mar 27, 2001
Method of making an electronic contact
TESSERA INC152 citations98
US6202297B1Mar 20, 2001
Socket for engaging bump leads on a microelectronic device and methods therefor
TESSERA INC208 citations98
US6114763ASep 5, 2000
Semiconductor package with translator for connection to an external substrate
TESSERA INC101 citations98
US6080932AJun 27, 2000
Semiconductor package assemblies with moisture vents
TESSERA INC135 citations98
US6002168ADec 14, 1999
Microelectronic component with rigid interposer
TESSERA INC204 citations98
US5994222ANov 30, 1999
Method of making chip mountings and assemblies
TESSERA INC121 citations98
US5934914AAug 10, 1999
Microelectronic contacts with asperities and methods of making same
TESSERA INC117 citations98
US5913109AJun 15, 1999
Fixtures and methods for lead bonding and deformation
TESSERA INC134 citations98
US5830782ANov 3, 1998
Microelectronic element bonding with deformation of leads in rows
TESSERA INC94 citations98
US5810609ASep 22, 1998
Socket for engaging bump leads on a microelectronic device and methods therefor
TESSERA INC167 citations98
US5798286AAug 25, 1998
Connecting multiple microelectronic elements with lead deformation
TESSERA INC134 citations98
US5688716ANov 18, 1997
Fan-out semiconductor chip assembly
TESSERA INC225 citations98
US5632631AMay 27, 1997
Microelectronic contacts with asperities and methods of making same
TESSERA INC280 citations98
US7166914B2Jan 23, 2007
Semiconductor package with heat sink
TESSERA INC81 citations97
US6191368B1Feb 20, 2001
Flexible, releasable strip leads
TESSERA INC89 citations97
US6104087AAug 15, 2000
Microelectronic assemblies with multiple leads
TESSERA INC77 citations97
US6965158B2Nov 15, 2005
Multi-layer substrates and fabrication processes
TESSERA INC48 citations96
US6870272B2Mar 22, 2005
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC55 citations96
US6821815B2Nov 23, 2004
Method of assembling a semiconductor chip package
TESSERA INC66 citations96
US6723584B2Apr 20, 2004
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC39 citations96
US6635553B1Oct 21, 2003
Microelectronic assemblies with multiple leads
TESSERA INC43 citations96
US6525429B1Feb 25, 2003
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC69 citations96
Showing the top 50 of 200 patents by PatentIndex Score.