Inventor

SCHULTZ ROSE ANN

US20 patents

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SCHULTZ ROSE ANN

NAT STARCH CHEM INVEST

Snap-cure epoxy adhesives

Die attach adhesives for use in microelectronic devices

Starch degradation using metal-based coordination complexes

Underfill encapsulants prepared from allylated amide compounds

Snap-cure epoxy adhesives

Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives

Methyltrioxorhenium-urea hydrogen peroxide epoxidation of olefins

Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives

Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives

Underfill encapsulants prepared from allylated amide compounds

Fluid resistant silicone encapsulant

Fluid resistant silicone encapsulant

Reagents for heat activated polymer crosslinking

Allylated amide compounds and die attach adhesives prepared therefrom

Snap-cure epoxy adhesives

Radiation- or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds

Reagents for heat activated polymer crosslinking

Fluid resistant silicone encapsulant

(unassigned)

Reactive radiation- or thermally-initiated cationically-curable epoxide monomers and compositions made from those monomers

NAT STARCH & CHEMICAL INVESTME

Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives