Inventor

YEN HUEI-MEI

TW2 patents

⚠️ This page may combine multiple inventors who share the name “YEN HUEI-MEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEGICA CORP

1 patent

US7947978B2May 24, 2011

Semiconductor chip with bond area

MEGICA CORP27 citations91

LIN MOU-SHIUNG

1 patent

US8304766B2Nov 6, 2012

Semiconductor chip with a bonding pad having contact and test areas

LIN MOU-SHIUNG5 citations72