Inventor

KATKAR RAJESH

US214 patents

⚠️ This page may combine multiple inventors who share the name “KATKAR RAJESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KATKAR RAJESH

INVENSAS CORP

Direct-bonded LED structure contacts and substrate contacts

Image sensor device

Making electrical components in handle wafers of integrated circuit packages

Image sensor device

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Multichip modules and methods of fabrication

Multiple bond via arrays of different wire heights on a same substrate

Microelectronic assemblies with cavities, and methods of fabrication

Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Multiple bond via arrays of different wire heights on a same substrate

Multiple plated via arrays of different wire heights on same substrate

Direct-bonded LED arrays and applications

Image sensor device

Multi-chip modules formed using wafer-level processing of a reconstitute wafer

Bond via array for thermal conductivity

Wafer-level flipped die stacks with leadframes or metal foil interconnects

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Thermal vias disposed in a substrate proximate to a well thereof

Reversed build-up substrate for 2.5D

Thermal vias disposed in a substrate proximate to a well thereof

INVENSAS BONDING TECH INC

Direct-bonded lamination for improved image clarity in optical devices

Molded direct bonded and interconnected stack

Multi-metal contact structure in microelectronic component

Diffusion barrier collar for interconnects

Direct-bonded optoelectronic interconnect for high-density integrated photonics

Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics

Cavity packages

Low temperature bonded structures

Bonded structures

Seal for microelectronic assembly

Bonded structures

Bonded structures without intervening adhesive

Large metal pads over TSV

Bonded structures

Protective elements for bonded structures

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Wafer-level bonding of obstructive elements

Bonded structures

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Multi-metal contact structure

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Molded direct bonded and interconnected stack

Electrical redundancy for bonded structures

Molded direct bonded and interconnected stack

Molded direct bonded and interconnected stack

XCELSIS CORP

Systems and methods for releveled bump planes for chiplets

Systems and methods for releveled bump planes for chiplets

INVENSAS LLC

Multi-chip modules formed using wafer-level processing of a reconstituted wafer

YANG SE YOUNG

TSV fabrication using a removable handling structure

GUPTA DEBABRATA

Interconnect structure