Inventor

WOYCHIK CHARLES G

US101 patents

⚠️ This page may combine multiple inventors who share the name “WOYCHIK CHARLES G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOYCHIK CHARLES G

INVENSAS CORP

Integrated circuits protected by substrates with cavities, and methods of manufacture

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

BVA interposer

Microelectronic assemblies with cavities, and methods of fabrication

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture

Bond via array for thermal conductivity

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Reduced stress TSV and interposer structures

Reduced stress TSV and interposer structures

Structure and method for integrated circuits packaging with increased density

Embedded graphite heat spreader for 3DIC

Hybrid 3D/2.5D interposer

BVA interposer

Embedded graphite heat spreader for 3DIC

Integrated circuits protected by substrates with cavities, and methods of manufacture

Tunable composite interposer

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Circuit assemblies with multiple interposer substrates, and methods of fabrication

Tunable composite interposer

Metal PVD-free conducting structures

Low CTE interposer without TSV structure

Stacked die integrated circuit

Stacked die integrated circuit

Integrated circuits protected by substrates with cavities, and methods of manufacture

IBM

Method and device for semiconductor testing using electrically conductive adhesives

Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate

Lead-free, high tin ternary solder alloy of tin, silver, and indium

Bonding of metallic surfaces

Process to produce a high temperature interconnection

Semiconductor chip carrier assembly

Low temperature controlled collapse chip attach process

Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate

Low temperature solder chip attach structure

Semiconductor testing using electrically conductive adhesives

Polymer with transient liquid phase bondable particles

Polymer with transient liquid phase bondable particles

Lead-free solder process

Stabilization of conductive adhesive by metallurgical bonding

Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate

Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections

Apparatus to reduce thermal fatigue stress on flip chip solder connections

Method for producing a reliable BGA solder joint interconnection

Method of making an electronic package

WOYCHIK CHARLES G

Tunable composite interposer

Low-stress TSV design using conductive particles

GEN ELECTRIC

CT detector module construction

BAUMGARTNER CHARLES EDWARD

Ultrasound transducer with improved acoustic performance

UZOH CYPRIAN EMEKA

Reduced stress TSV and interposer structures

DESAI Kishor

Low cost hybrid high density package