P

Inventor

HOMMA YOSHIO

JP46 patents
⚠️ This page may combine multiple inventors who share the name “HOMMA YOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

33 patents
US6117775ASep 12, 2000

Polishing method

HITACHI LTD254 citations99
US5609511AMar 11, 1997

Polishing method

HITACHI LTD413 citations99
US4897709AJan 30, 1990

Titanium nitride film in contact hole with large aspect ratio

HITACHI LTD151 citations99
US6562719B2May 13, 2003

Methods of polishing, interconnect-fabrication, and producing semiconductor devices

HITACHI LTD88 citations98
US6326299B1Dec 4, 2001

Method for manufacturing a semiconductor device

HITACHI LTD88 citations98
US6596638B1Jul 22, 2003

Polishing method

HITACHI LTD33 citations96
US6561883B1May 13, 2003

Method of polishing

HITACHI LTD59 citations96
US6376345B1Apr 23, 2002

Process for manufacturing semiconductor integrated circuit device

HITACHI LTD46 citations96
US6043155AMar 28, 2000

Polishing agent and polishing method

HITACHI LTD56 citations96
US5772780AJun 30, 1998

Polishing agent and polishing method

HITACHI LTD68 citations96
US5270259ADec 14, 1993

Method for fabricating an insulating film from a silicone resin using O.sub.

HITACHI LTD69 citations96
US5177589AJan 5, 1993

Refractory metal thin film having a particular step coverage factor and ratio of surface roughness

HITACHI LTD54 citations96
US4599135AJul 8, 1986

Thin film deposition

HITACHI LTD82 citations96
US4717462AJan 5, 1988

Sputtering apparatus

HITACHI LTD102 citations95
US6638854B2Oct 28, 2003

Semiconductor device and method for manufacturing the same

HITACHI LTD25 citations93
US6561875B1May 13, 2003

Apparatus and method for producing substrate with electrical wire thereon

HITACHI LTD20 citations93
US6509273B1Jan 21, 2003

Method for manufacturing a semiconductor device

HITACHI LTD36 citations93
US6458674B1Oct 1, 2002

Process for manufacturing semiconductor integrated circuit device

HITACHI LTD16 citations93
US6565422B1May 20, 2003

Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus

HITACHI LTD29 citations92
US5175017ADec 29, 1992

Method of forming metal or metal silicide film

HITACHI LTD43 citations92
US4842891AJun 27, 1989

Method of forming a copper film by chemical vapor deposition

HITACHI LTD27 citations92
US4539616ASep 3, 1985

Thin film magnetic head and fabricating method thereof

HITACHI LTD31 citations92
US6180020B1Jan 30, 2001

Polishing method and apparatus

HITACHI LTD46 citations91
US6478977B1Nov 12, 2002

Polishing method and apparatus

HITACHI LTD15 citations83
US6531400B2Mar 11, 2003

Process for manufacturing semiconductor integrated circuit device

HITACHI LTD12 citations82
US7132367B2Nov 7, 2006

Polishing method

HITACHI LTD4 citations74
US6221773B1Apr 24, 2001

Method for working semiconductor wafer

HITACHI LTD12 citations74
US5444000AAug 22, 1995

Method of fabricating integrated circuit with improved yield rate

HITACHI LTD12 citations74
US4710398ADec 1, 1987

Semiconductor device and manufacturing method thereof

HITACHI LTD17 citations74
US4073054AFeb 14, 1978

Method of fabricating semiconductor device

HITACHI LTD16 citations73
US7279425B2Oct 9, 2007

Polishing method

HITACHI LTD2 citations63
US6676496B2Jan 13, 2004

Apparatus for processing semiconductor wafers

HITACHI LTD2 citations63
US4394245AJul 19, 1983

Sputtering apparatus

HITACHI LTD1 citations52

RENESAS TECH CORP

12 patents

OHASHI NAOFUMI

1 patent