Inventor
HUANG CHIH-SEN
TW69 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIH-SEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
48 patentsUS8765546B1Jul 1, 2014
Method for fabricating fin-shaped field-effect transistor
UNITED MICROELECTRONICS CORP107 citations98
US9209273B1Dec 8, 2015
Method of fabricating metal gate structure
UNITED MICROELECTRONICS CORP59 citations97
US9530778B1Dec 27, 2016
Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gate
UNITED MICROELECTRONICS CORP40 citations94
US9263392B1Feb 16, 2016
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP25 citations94
US9006804B2Apr 14, 2015
Semiconductor device and fabrication method thereof
UNITED MICROELECTRONICS CORP22 citations93
US8962490B1Feb 24, 2015
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP19 citations93
US8836129B1Sep 16, 2014
Plug structure
UNITED MICROELECTRONICS CORP29 citations93
US9455227B1Sep 27, 2016
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP23 citations92
US8802521B1Aug 12, 2014
Semiconductor fin-shaped structure and manufacturing process thereof
UNITED MICROELECTRONICS CORP22 citations92
US10049929B2Aug 14, 2018
Method of making semiconductor structure having contact plug
UNITED MICROELECTRONICS CORP11 citations84
US9698255B2Jul 4, 2017
Semiconductor device having gate structure with doped hard mask
UNITED MICROELECTRONICS CORP5 citations84
US9698047B2Jul 4, 2017
Dummy gate technology to avoid shorting circuit
UNITED MICROELECTRONICS CORP12 citations84
US9673100B2Jun 6, 2017
Semiconductor device having contact plug in two dielectric layers and two etch stop layers
UNITED MICROELECTRONICS CORP7 citations84
US9607892B2Mar 28, 2017
Method for forming a two-layered hard mask on top of a gate structure
UNITED MICROELECTRONICS CORP9 citations84
US9543211B1Jan 10, 2017
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP15 citations84
US9412745B1Aug 9, 2016
Semiconductor structure having a center dummy region
UNITED MICROELECTRONICS CORP8 citations84
US9401358B1Jul 26, 2016
Semiconductor device structure
UNITED MICROELECTRONICS CORP11 citations84
US9324610B2Apr 26, 2016
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP9 citations84
US9312356B1Apr 12, 2016
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP13 citations84
US9306032B2Apr 5, 2016
Method of forming self-aligned metal gate structure in a replacement gate process using tapered interlayer dielectric
UNITED MICROELECTRONICS CORP14 citations84
US9263540B1Feb 16, 2016
Metal gate structure
UNITED MICROELECTRONICS CORP8 citations84
US9230816B1Jan 5, 2016
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP8 citations84
US9147747B2Sep 29, 2015
Semiconductor structure with hard mask disposed on the gate structure
UNITED MICROELECTRONICS CORP5 citations84
US9064931B2Jun 23, 2015
Semiconductor structure having contact plug and metal gate transistor and method of making the same
UNITED MICROELECTRONICS CORP10 citations84
US8993433B2Mar 31, 2015
Manufacturing method for forming a self aligned contact
UNITED MICROELECTRONICS CORP9 citations84
US8921947B1Dec 30, 2014
Multi-metal gate semiconductor device having triple diameter metal opening
UNITED MICROELECTRONICS CORP15 citations84
US8785283B2Jul 22, 2014
Method for forming semiconductor structure having metal connection
UNITED MICROELECTRONICS CORP8 citations84
US10600882B2Mar 24, 2020
Semiconductor structure
UNITED MICROELECTRONICS CORP2 citations73
US10026726B2Jul 17, 2018
Dummy gate technology to avoid shorting circuit
UNITED MICROELECTRONICS CORP3 citations73
US9985123B2May 29, 2018
Method for fabricating a semiconductor device having gate structure with doped hard mask
UNITED MICROELECTRONICS CORP2 citations73
US9985020B2May 29, 2018
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP2 citations73
US9875941B1Jan 23, 2018
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP4 citations73
US9870996B1Jan 16, 2018
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP5 citations73
US9780199B2Oct 3, 2017
Method for forming semiconductor device
UNITED MICROELECTRONICS CORP4 citations73
US9548239B2Jan 17, 2017
Method for fabricating contact plug in an interlayer dielectric layer
UNITED MICROELECTRONICS CORP3 citations73
US9466564B1Oct 11, 2016
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP4 citations73
US9240403B2Jan 19, 2016
Embedded resistor
UNITED MICROELECTRONICS CORP6 citations73
US9117886B2Aug 25, 2015
Method for fabricating a semiconductor device by forming and removing a dummy gate structure
UNITED MICROELECTRONICS CORP5 citations73
US9064814B2Jun 23, 2015
Semiconductor structure having metal gate and manufacturing method thereof
UNITED MICROELECTRONICS CORP5 citations73
US9613969B2Apr 4, 2017
Semiconductor structure and method of forming the same
UNITED MICROELECTRONICS CORP2 citations72
US9449964B2Sep 20, 2016
Semiconductor process
UNITED MICROELECTRONICS CORP2 citations63
US9349639B2May 24, 2016
Method for manufacturing a contact structure used to electrically connect a semiconductor device
UNITED MICROELECTRONICS CORP2 citations63
US9331171B2May 3, 2016
Manufacturing method for forming semiconductor structure
UNITED MICROELECTRONICS CORP2 citations63
US9196352B2Nov 24, 2015
Static random access memory unit cell structure and static random access memory unit cell layout structure
UNITED MICROELECTRONICS CORP2 citations63
US8921226B2Dec 30, 2014
Method of forming semiconductor structure having contact plug
UNITED MICROELECTRONICS CORP3 citations63
US9984974B1May 29, 2018
Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
UNITED MICROELECTRONICS CORP1 citations62
US9466521B2Oct 11, 2016
Semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
UNITED MICROELECTRONICS CORP1 citations62
US10553576B2Feb 4, 2020
Method for filling patterns
UNITED MICROELECTRONICS CORP0 citations52
UNITED MICROELECTRNICS CORP
1 patentHUNG CHING-WEN
1 patentShowing the top 50 of 69 patents by PatentIndex Score.