P

Inventor

HUANG CHIH-SEN

TW69 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIH-SEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

48 patents
US8765546B1Jul 1, 2014

Method for fabricating fin-shaped field-effect transistor

UNITED MICROELECTRONICS CORP107 citations98
US9209273B1Dec 8, 2015

Method of fabricating metal gate structure

UNITED MICROELECTRONICS CORP59 citations97
US9530778B1Dec 27, 2016

Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gate

UNITED MICROELECTRONICS CORP40 citations94
US9263392B1Feb 16, 2016

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP25 citations94
US9006804B2Apr 14, 2015

Semiconductor device and fabrication method thereof

UNITED MICROELECTRONICS CORP22 citations93
US8962490B1Feb 24, 2015

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP19 citations93
US8836129B1Sep 16, 2014

Plug structure

UNITED MICROELECTRONICS CORP29 citations93
US9455227B1Sep 27, 2016

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP23 citations92
US8802521B1Aug 12, 2014

Semiconductor fin-shaped structure and manufacturing process thereof

UNITED MICROELECTRONICS CORP22 citations92
US10049929B2Aug 14, 2018

Method of making semiconductor structure having contact plug

UNITED MICROELECTRONICS CORP11 citations84
US9698255B2Jul 4, 2017

Semiconductor device having gate structure with doped hard mask

UNITED MICROELECTRONICS CORP5 citations84
US9698047B2Jul 4, 2017

Dummy gate technology to avoid shorting circuit

UNITED MICROELECTRONICS CORP12 citations84
US9673100B2Jun 6, 2017

Semiconductor device having contact plug in two dielectric layers and two etch stop layers

UNITED MICROELECTRONICS CORP7 citations84
US9607892B2Mar 28, 2017

Method for forming a two-layered hard mask on top of a gate structure

UNITED MICROELECTRONICS CORP9 citations84
US9543211B1Jan 10, 2017

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP15 citations84
US9412745B1Aug 9, 2016

Semiconductor structure having a center dummy region

UNITED MICROELECTRONICS CORP8 citations84
US9401358B1Jul 26, 2016

Semiconductor device structure

UNITED MICROELECTRONICS CORP11 citations84
US9324610B2Apr 26, 2016

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP9 citations84
US9312356B1Apr 12, 2016

Semiconductor device and manufacturing method thereof

UNITED MICROELECTRONICS CORP13 citations84
US9306032B2Apr 5, 2016

Method of forming self-aligned metal gate structure in a replacement gate process using tapered interlayer dielectric

UNITED MICROELECTRONICS CORP14 citations84
US9263540B1Feb 16, 2016

Metal gate structure

UNITED MICROELECTRONICS CORP8 citations84
US9230816B1Jan 5, 2016

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP8 citations84
US9147747B2Sep 29, 2015

Semiconductor structure with hard mask disposed on the gate structure

UNITED MICROELECTRONICS CORP5 citations84
US9064931B2Jun 23, 2015

Semiconductor structure having contact plug and metal gate transistor and method of making the same

UNITED MICROELECTRONICS CORP10 citations84
US8993433B2Mar 31, 2015

Manufacturing method for forming a self aligned contact

UNITED MICROELECTRONICS CORP9 citations84
US8921947B1Dec 30, 2014

Multi-metal gate semiconductor device having triple diameter metal opening

UNITED MICROELECTRONICS CORP15 citations84
US8785283B2Jul 22, 2014

Method for forming semiconductor structure having metal connection

UNITED MICROELECTRONICS CORP8 citations84
US10600882B2Mar 24, 2020

Semiconductor structure

UNITED MICROELECTRONICS CORP2 citations73
US10026726B2Jul 17, 2018

Dummy gate technology to avoid shorting circuit

UNITED MICROELECTRONICS CORP3 citations73
US9985123B2May 29, 2018

Method for fabricating a semiconductor device having gate structure with doped hard mask

UNITED MICROELECTRONICS CORP2 citations73
US9985020B2May 29, 2018

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations73
US9875941B1Jan 23, 2018

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP4 citations73
US9870996B1Jan 16, 2018

Semiconductor device and method of fabricating the same

UNITED MICROELECTRONICS CORP5 citations73
US9780199B2Oct 3, 2017

Method for forming semiconductor device

UNITED MICROELECTRONICS CORP4 citations73
US9548239B2Jan 17, 2017

Method for fabricating contact plug in an interlayer dielectric layer

UNITED MICROELECTRONICS CORP3 citations73
US9466564B1Oct 11, 2016

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP4 citations73
US9240403B2Jan 19, 2016

Embedded resistor

UNITED MICROELECTRONICS CORP6 citations73
US9117886B2Aug 25, 2015

Method for fabricating a semiconductor device by forming and removing a dummy gate structure

UNITED MICROELECTRONICS CORP5 citations73
US9064814B2Jun 23, 2015

Semiconductor structure having metal gate and manufacturing method thereof

UNITED MICROELECTRONICS CORP5 citations73
US9613969B2Apr 4, 2017

Semiconductor structure and method of forming the same

UNITED MICROELECTRONICS CORP2 citations72
US9449964B2Sep 20, 2016

Semiconductor process

UNITED MICROELECTRONICS CORP2 citations63
US9349639B2May 24, 2016

Method for manufacturing a contact structure used to electrically connect a semiconductor device

UNITED MICROELECTRONICS CORP2 citations63
US9331171B2May 3, 2016

Manufacturing method for forming semiconductor structure

UNITED MICROELECTRONICS CORP2 citations63
US9196352B2Nov 24, 2015

Static random access memory unit cell structure and static random access memory unit cell layout structure

UNITED MICROELECTRONICS CORP2 citations63
US8921226B2Dec 30, 2014

Method of forming semiconductor structure having contact plug

UNITED MICROELECTRONICS CORP3 citations63
US9984974B1May 29, 2018

Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer

UNITED MICROELECTRONICS CORP1 citations62
US9466521B2Oct 11, 2016

Semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer

UNITED MICROELECTRONICS CORP1 citations62
US10553576B2Feb 4, 2020

Method for filling patterns

UNITED MICROELECTRONICS CORP0 citations52

UNITED MICROELECTRNICS CORP

1 patent

HUNG CHING-WEN

1 patent

Showing the top 50 of 69 patents by PatentIndex Score.