Inventor

LI ZHENGWEN

US113 patents

⚠️ This page may combine multiple inventors who share the name “LI ZHENGWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI ZHENGWEN

IBM

Techniques for fabricating janus MEMS transistors

Single electron transistor with self-aligned Coulomb blockade

Carbon nanotube vacuum transistors

Integrated circuit having MIM capacitor with refractory metal silicided strap and method to fabricate same

Semiconductor device with authentication code

Carbon-doped cap for a raised active semiconductor region

FinFET including varied fin height

FinFET including varied fin height

Multi-composition gate dielectric field effect transistors

Replacement gate self-aligned carbon nanostructure transistor

Trench silicide contact with low interface resistance

Field effect structure and method including spacer shaped metal gate with asymmetric source and drain regions

FDSOI with on-chip physically unclonable function

Secure semiconductor chip by piezoelectricity

Piezoelectric vacuum transistor

Vertically aligned carbon nanotube trapezoid FIN structure

Carbon nanotube vacuum transistors

FDSOI with on-chip physically unclonable function

Vertically integrated nanotube and quantum dot LED for active matrix display

Dielectric thermal conductor for passivating efuse and metal resistor

Transistor with trapeziod shaped carbon namotubes

High density nano-array for sensing

High density nanofluidic structure with precisely controlled nano-channel dimensions

Transistor device with vertical carbon nanotube (CNT) arrays or non-vertical tapered CNT arrays

Dielectric thermal conductor for passivating eFuse and metal resistor

Method for forming metal semiconductor alloys in contact holes and trenches

Janus complementary MEMS transistors and circuits

Piezoelectric vacuum transistor

On-chip integrated temperature protection device based on gel electrolyte

Three-dimensional integration of neurosynaptic chips

Nanoparticle with plural functionalities, and method of forming the nanoparticle

Multi-faced component-based electromechanical device

Fringing field assisted dielectrophoresis assembly of carbon nanotubes

Transistor devices with tapered suspended vertical arrays of carbon nanotubes

Bonded structure employing metal semiconductor alloy bonding

GUO DECHAO

Deposition on a nanowire using atomic layer deposition

Method to fabricate multicrystal solar cell with light trapping surface using nanopore copolymer

Deposition on a nanowire using atomic layer deposition

LI ZHENGWEN

Structure and method to make replacement metal gate and contact metal

Etch stop layer formation in metal gate process

Self-aligned bottom plate for metal high-K dielectric metal insulator metal (MIM) embedded dynamic random access memory

FAROOQ MUKTA G

Bonded structure employing metal semiconductor alloy bonding

Bonded structure with enhanced adhesion strength

CHENG TIEN-JEN

Selective copper encapsulation layer deposition

Conformal adhesion promoter liner for metal interconnects

HUNAN YINSUN BAMBOO IND CO LTD

Fork

Spoon

YU JIAN

Metal semiconductor alloy contact with low resistance

Li yan zun

Reliable electrical fuse with localized programming

CLEVENGER LAWRENCE A

Solar module with overheat protection