Inventor
CHEN YA-HSIANG
TW4 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YA-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KINSUS INTERCONNECT TECH CORP
3 patentsUS8377815B2Feb 19, 2013
Manufacturing method of a semiconductor load board
KINSUS INTERCONNECT TECH CORP4 citations60
US7871892B2Jan 18, 2011
Method for fabricating buried capacitor structure
KINSUS INTERCONNECT TECH CORP3 citations60
US8754328B2Jun 17, 2014
Laminate circuit board with a multi-layer circuit structure
KINSUS INTERCONNECT TECH CORP0 citations38