Inventor
KHAN REZA-UR RAHMAN
US33 patents
⚠️ This page may combine multiple inventors who share the name “KHAN REZA-UR RAHMAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BROADCOM CORP
30 patentsUS7161239B2Jan 9, 2007
Ball grid array package enhanced with a thermal and electrical connector
BROADCOM CORP105 citations99
US6989593B2Jan 24, 2006
Die-up ball grid array package with patterned stiffener opening
BROADCOM CORP93 citations99
US6906414B2Jun 14, 2005
Ball grid array package with patterned stiffener layer
BROADCOM CORP222 citations99
US6861750B2Mar 1, 2005
Ball grid array package with multiple interposers
BROADCOM CORP163 citations99
US7781266B2Aug 24, 2010
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
BROADCOM CORP83 citations98
US7582951B2Sep 1, 2009
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
BROADCOM CORP109 citations98
US7432586B2Oct 7, 2008
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
BROADCOM CORP66 citations98
US7271479B2Sep 18, 2007
Flip chip package including a non-planar heat spreader and method of making the same
BROADCOM CORP72 citations98
US6853070B2Feb 8, 2005
Die-down ball grid array package with die-attached heat spreader and method for making the same
BROADCOM CORP82 citations98
US7259448B2Aug 21, 2007
Die-up ball grid array package with a heat spreader and method for making the same
BROADCOM CORP61 citations97
US6882042B2Apr 19, 2005
Thermally and electrically enhanced ball grid array packaging
BROADCOM CORP86 citations97
US7786591B2Aug 31, 2010
Die down ball grid array package
BROADCOM CORP46 citations96
US7259457B2Aug 21, 2007
Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
BROADCOM CORP46 citations96
US7245500B2Jul 17, 2007
Ball grid array package with stepped stiffener layer
BROADCOM CORP58 citations96
US7241645B2Jul 10, 2007
Method for assembling a ball grid array package with multiple interposers
BROADCOM CORP50 citations96
US7005737B2Feb 28, 2006
Die-up ball grid array package with enhanced stiffener
BROADCOM CORP58 citations96
US6825108B2Nov 30, 2004
Ball grid array package fabrication with IC die support structures
BROADCOM CORP58 citations96
US6887741B2May 3, 2005
Method for making an enhanced die-up ball grid array package with two substrates
BROADCOM CORP37 citations95
US6876553B2Apr 5, 2005
Enhanced die-up ball grid array package with two substrates
BROADCOM CORP52 citations95
US6879039B2Apr 12, 2005
Ball grid array package substrates and method of making the same
BROADCOM CORP54 citations94
US8021927B2Sep 20, 2011
Die down ball grid array packages and method for making same
BROADCOM CORP25 citations93
US7893546B2Feb 22, 2011
Ball grid array package enhanced with a thermal and electrical connector
BROADCOM CORP16 citations93
US7719110B2May 18, 2010
Flip chip package including a non-planar heat spreader and method of making the same
BROADCOM CORP27 citations93
US7132744B2Nov 7, 2006
Enhanced die-up ball grid array packages and method for making the same
BROADCOM CORP45 citations93
US7078806B2Jul 18, 2006
IC die support structures for ball grid array package fabrication
BROADCOM CORP30 citations93
US7781882B2Aug 24, 2010
Low voltage drop and high thermal performance ball grid array package
BROADCOM CORP22 citations92
US7312108B2Dec 25, 2007
Method for assembling a ball grid array package with two substrates
BROADCOM CORP25 citations91
US7791189B2Sep 7, 2010
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
BROADCOM CORP13 citations84
US7405145B2Jul 29, 2008
Ball grid array package substrates with a modified central opening and method for making the same
BROADCOM CORP11 citations82
US7629681B2Dec 8, 2009
Ball grid array package with patterned stiffener surface and method of assembling the same
BROADCOM CORP6 citations73