Inventor
WATANABE KAORI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “WATANABE KAORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
7 patentsUS6432836B1Aug 13, 2002
Cleaning method for semiconductor substrate and cleaning solution
NEC CORP29 citations92
US6245650B1Jun 12, 2001
Process for production of semiconductor device
NEC CORP36 citations92
US6164133ADec 26, 2000
Method and apparatus for pre-processing of semiconductor substrate surface analysis
NEC CORP26 citations92
US5549798AAug 27, 1996
Wet processing apparatus having individual reactivating feedback paths for anode and cathode water
NEC CORP21 citations91
US6444010B1Sep 3, 2002
Platinum group impurity recovery liquid and method for recovering platinum group impurity
NEC CORP12 citations73
US6551945B2Apr 22, 2003
Process for manufacturing a semiconductor device
NEC CORP2 citations63
US6468357B1Oct 22, 2002
Remover for a ruthenium containing metal and use thereof
NEC CORP5 citations63
G C DENTAL IND CORP
5 patentsUSD873131SJan 21, 2020
Packaging container
G C DENTAL IND CORP22 citations93
US10821221B2Nov 3, 2020
Encased syringe
G C DENTAL IND CORP7 citations79
USD967713SOct 25, 2022
Packaging container
G C DENTAL IND CORP0 citations62
US11583376B2Feb 21, 2023
Dental gypsum slurry
G C DENTAL IND CORP0 citations59
US12037180B2Jul 16, 2024
Packaging container
G C DENTAL IND CORP0 citations51
NEC ELECTRONICS CORP
4 patentsUS7442652B2Oct 28, 2008
Method for removing contamination and method for fabricating semiconductor device
NEC ELECTRONICS CORP3 citations63
US6877518B2Apr 12, 2005
Chemical solution treatment apparatus for semiconductor substrate
NEC ELECTRONICS CORP2 citations63
US6911096B2Jun 28, 2005
Method of collecting impurities on surface of semiconductor wafer
NEC ELECTRONICS CORP4 citations62
US7566663B2Jul 28, 2009
Method for manufacturing semiconductor device or semiconductor wafer using a chucking unit
NEC ELECTRONICS CORP0 citations40