Inventor

WANG CONNIE PIN-CHIN

US19 patents

⚠️ This page may combine multiple inventors who share the name “WANG CONNIE PIN-CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG CONNIE PIN-CHIN

ADVANCED MICRO DEVICES INC

Method of forming low resistance barrier on low k interconnect with electrolessly plated copper seed layer

Copper interconnects with metal capping layer and selective copper alloys

Cu interconnects with composite barrier layers for wafer-to-wafer uniformity

Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliability

Composite barrier layers with controlled copper interface surface roughness

Method of forming composite barrier layers with controlled copper interface surface roughness

Semiconductor component and method of manufacture

Method of self-annealing conductive lines that separates grain size effects from alloy mobility

Method of forming a contact in a semiconductor device with formation of silicide prior to plasma treatment

Method for manufacturing a semiconductor component that inhibits formation of wormholes

Aggressive cleaning process for semiconductor device contact formation

SPANSION LLC

Memory device having a nanocrystal charge storage region and method

Method of forming a contact in a semiconductor device with engineered plasma treatment profile of barrier metal layer

Method for manufacturing a memory device having a nanocrystal charge storage region

Method for manufacturing a memory device having a nanocrystal charge storage region

Semiconductor component having a contact structure and method of manufacture

MONTEREY RES LLC

Memory device interconnects and method of manufacture

Memory device interconnects and method of manufacture

BESSER PAUL R

Method for manufacturing a contact for a semiconductor component and related structure