Inventor

WANG CHING-CHUN

TW136 patents

⚠️ This page may combine multiple inventors who share the name “WANG CHING-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG CHING-CHUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Hybrid bond using a copper alloy for yield improvement

Hybrid bond pad structure

Pad structure for front side illuminated image sensor

Extra doped region for back-side deep trench isolation

Via support structure under pad areas for BSI bondability improvement

Image sensor comprising reflective guide layer and method of forming the same

Hybrid bonding technology for stacking integrated circuits

Image sensing device

Via support structure under pad areas for BSI bondability improvement

Apparatus for reducing optical cross-talk in image sensors

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Via support structure under pad areas for BSI bondability improvement

Extra doped region for back-side deep trench isolation

Image sensor comprising reflective guide layer and method of forming the same

Via support structure under pad areas for BSI bondability improvement

Bond pad structure for bonding improvement

Stacked SPAD image sensor

Method for reducing optical cross-talk in image sensors

Extra doped region for back-side deep trench isolation

Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors

Deep trench isolation fabrication for BSI image sensor

Apparatus and method for reducing optical cross-talk in image sensors

Backside illuminated image sensor with negatively charged layer

Apparatus and method for reducing optical cross-talk in image sensors

3DIC structure and method for hybrid bonding semiconductor wafers

Hybrid bonding technology for stacking integrated circuits

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Hybrid bond pad structure

Hybrid bonding technology for stacking integrated circuits

Vertical gate field effect transistor

Hybrid bonding technology for stacking integrated circuits

Bond pad structure for bonding improvement

Metal reflector grounding for noise reduction in light detector

Apparatus for reducing optical cross-talk in image sensors

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Pad structure for front side illuminated image sensor

Semiconductor structure and method for manufacturing the same

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

TAIWAN SEMICONDUCTOR MFG

Image sensor element for backside-illuminated sensor

Method for making spectrally efficient photodiode structures for CMOS color imagers

Backside illuminated sensor processing

Multiple metal film stack in BSI chips

Color filter for image sensor

Method to optimize substrate thickness for image sensor device

Photodetector for backside-illuminated sensor

Method for making spectrally efficient photodiode structures for CMOS color imagers

Lateral P-I-N photodiode element with high quantum efficiency for a CMOS image sensor

CYPRESS SEMICONDUCTOR CORP

Pixel having an oxide layer with step region

TING SHYH-FANN

Multiple metal film stack in BSI chips

HSU TZU-HSUAN

Method to optimize substrate thickness for image sensor device