Inventor

ST AMAND ROGER D

US36 patents

⚠️ This page may combine multiple inventors who share the name “ST AMAND ROGER D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST AMAND ROGER D

AMKOR TECHNOLOGY INC

Flip chip bump structure and fabrication method

Stacked semiconductor die assembly having at least one support

Stacked flip chip die assembly

Stacked die assembly having semiconductor die overhanging support

Stacked die assembly having semiconductor die projecting beyond support

Stacked-die extension support structure and method thereof

Thin bonded interposer package

Semiconductor package with fast power-up cycle and method of making same

Stacked electronic component package having film-on-wire spacer

Die-mounting substrate and method incorporating dummy traces for improving mounting film planarity

Methods and structures for increasing the allowable die size in TMV packages

Thin bonded interposer package

Semiconductor devices and methods of making semiconductor devices

Stackable package and method

Flip chip bump structure and fabrication method

Thin bonded interposer package

Column and stacking balls package fabrication method and structure

AMKOR TECH SINGAPORE HOLDING PTE LTD

Thin bonded interposer package

Semiconductor devices and methods of manufacturing semiconductor devices

Stackable package and method

Semiconductor devices and methods of manufacturing semiconductor devices

Methods and structures for increasing the allowable die size in TMV packages

Semiconductor devices and methods of manufacturing semiconductor devices

ST AMAND ROGER D

Underfill contacting stacking balls package fabrication method and structure

Shielding for a semiconductor package

Stacked electronic component package having film-on-wire spacer

Stacked inverted flip chip package and fabrication method

Semiconductor package with fast power-up cycle and method of making same

ROA FERNANDO

Package in package device for RF transceiver module

Package in package device for RF transceiver module

MICROCHIP TECH INC

Functional pathway configuration at a system/IC interface

Method of forming narrow thermal silicon dioxide side isolation regions in a semiconductor substrate and MOS semiconductor devices fabricated by this method

SCANLAN CHRISTOPHER M

Fan out build up substrate stackable package and method

DARVEAUX ROBERT FRANCIS

Stackable package and method

NICHOLLS LOUIS W

Methods and structures for increasing the allowable die size in TMV packages

HUEMOELLER RONALD PATRICK

Flip chip bump structure and fabrication method