Inventor
DUNNE RAJIV CARL
US3 patents
Patents
3 patentsUS7126217B2Oct 24, 2006
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
TEXAS INSTRUMENTS INC30 citations90
US7572677B2Aug 11, 2009
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
TEXAS INSTRUMENTS INC14 citations81
US7504283B2Mar 17, 2009
Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate
TEXAS INSTRUMENTS INC15 citations79