Inventor
CHEN CHENSON
US3 patents
Patents
3 patentsUS10418350B2Sep 17, 2019
Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure
MASSACHUSETTS INST TECHNOLOGY12 citations82
US9780075B2Oct 3, 2017
Interconnect structures for assembly of multi-layer semiconductor devices
MASSACHUSETTS INST TECHNOLOGY7 citations82
US10079224B2Sep 18, 2018
Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure
MASSACHUSETTS INST TECHNOLOGY3 citations71