Inventor
KAEDING JOHN F
US29 patents
⚠️ This page may combine multiple inventors who share the name “KAEDING JOHN F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
20 patentsUS11018098B2May 25, 2021
Fabricated two-sided millimeter wave antenna using through-silicon-vias
MICRON TECHNOLOGY INC6 citations84
US10103038B1Oct 16, 2018
Thrumold post package with reverse build up hybrid additive structure
MICRON TECHNOLOGY INC11 citations83
US11728276B2Aug 15, 2023
Semiconductor devices having integrated optical components
MICRON TECHNOLOGY INC2 citations73
US11227777B2Jan 18, 2022
Sacrificial separators for wafer level encapsulating
MICRON TECHNOLOGY INC2 citations73
US11114383B2Sep 7, 2021
Semiconductor devices having integrated optical components
MICRON TECHNOLOGY INC5 citations73
US10586780B2Mar 10, 2020
Semiconductor device modules including a die electrically connected to posts and related methods
MICRON TECHNOLOGY INC2 citations71
US10325874B2Jun 18, 2019
Device module having a plurality of dies electrically connected by posts
MICRON TECHNOLOGY INC4 citations71
US10192843B1Jan 29, 2019
Methods of making semiconductor device modules with increased yield
MICRON TECHNOLOGY INC4 citations71
US12272870B2Apr 8, 2025
Tunable integrated millimeter wave antenna using laser ablation and/or fuses
MICRON TECHNOLOGY INC0 citations62
US12051670B2Jul 30, 2024
Use of pre-channeled materials for anisotropic conductors
MICRON TECHNOLOGY INC0 citations62
US11908814B2Feb 20, 2024
Fabricated two-sided millimeter wave antenna using through-silicon-vias
MICRON TECHNOLOGY INC0 citations62
US11670707B2Jun 6, 2023
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11588233B2Feb 21, 2023
Tunable integrated millimeter wave antenna using laser ablation and/or fuses
MICRON TECHNOLOGY INC0 citations62
US11393920B2Jul 19, 2022
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11139262B2Oct 5, 2021
Use of pre-channeled materials for anisotropic conductors
MICRON TECHNOLOGY INC0 citations62
US12526974B2Jan 13, 2026
Multiple, alternating epitaxial silicon for horizontal access devices in vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC0 citations60
US12507392B2Dec 23, 2025
Multiple, alternating epitaxial silicon
MICRON TECHNOLOGY INC0 citations53
US10566686B2Feb 18, 2020
Stacked memory package incorporating millimeter wave antenna in die stack
MICRON TECHNOLOGY INC0 citations52
US10593568B2Mar 17, 2020
Thrumold post package with reverse build up hybrid additive structure
MICRON TECHNOLOGY INC0 citations51
US12324244B2Jun 3, 2025
Epitaxial single crystalline silicon growth for memory arrays
MICRON TECHNOLOGY INC0 citations50
UNIV CALIFORNIA
4 patentsUS7691658B2Apr 6, 2010
Method for improved growth of semipolar (Al,In,Ga,B)N
UNIV CALIFORNIA266 citations98
US7687293B2Mar 30, 2010
Method for enhancing growth of semipolar (Al,In,Ga,B)N via metalorganic chemical vapor deposition
UNIV CALIFORNIA17 citations92
US8368179B2Feb 5, 2013
Miscut semipolar optoelectronic device
UNIV CALIFORNIA5 citations84
US7858996B2Dec 28, 2010
Method for growth of semipolar (Al,In,Ga,B)N optoelectronic devices
UNIV CALIFORNIA11 citations84