Inventor

DITZEL ECKHARD

DE7 patents

⚠️ This page may combine multiple inventors who share the name “DITZEL ECKHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HERAEUS DEUTSCHLAND GMBH & CO KG

2 patents

US10176420B2Jan 8, 2019

Strip-type substrate for producing chip card modules

HERAEUS DEUTSCHLAND GMBH & CO KG0 citations47

US9941197B2Apr 10, 2018

Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

HERAEUS DEUTSCHLAND GMBH & CO KG0 citations47

GESIPA BLINDNIETTECHNIK

1 patent

US5496140AMar 5, 1996

Blind rivets and method for its manufacture

GESIPA BLINDNIETTECHNIK62 citations91

ZITZLSPERGER MICHAEL

1 patent

US9048393B2Jun 2, 2015

Optoelectronic component

ZITZLSPERGER MICHAEL3 citations60

OSRAM GMBH

1 patent

US10468569B2Nov 5, 2019

Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

OSRAM GMBH0 citations43

KLEIN ANDREAS STEFFEN

1 patent

US9756730B2Sep 5, 2017

Chip-integrated through-plating of multi-layer substrates

KLEIN ANDREAS STEFFEN1 citations40

DITZEL ECKHARD

1 patent

US8153232B2Apr 10, 2012

Laminated substrates for mounting electronic parts and methods for making same

DITZEL ECKHARD0 citations36