Inventor
KANG HEE-SOO
KR44 patents
⚠️ This page may combine multiple inventors who share the name “KANG HEE-SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
32 patentsUS8878309B1Nov 4, 2014
Semiconductor device having 3D channels, and methods of fabricating semiconductor devices having 3D channels
SAMSUNG ELECTRONICS CO LTD105 citations97
US9379106B2Jun 28, 2016
Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels
SAMSUNG ELECTRONICS CO LTD18 citations92
US8053347B2Nov 8, 2011
Method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD25 citations92
US7358142B2Apr 15, 2008
Method for forming a FinFET by a damascene process
SAMSUNG ELECTRONICS CO LTD29 citations92
US7056781B2Jun 6, 2006
Method of forming fin field effect transistor
SAMSUNG ELECTRONICS CO LTD51 citations92
US9012281B2Apr 21, 2015
Semiconductor device fabrication methods
SAMSUNG ELECTRONICS CO LTD14 citations84
US7868467B2Jan 11, 2011
Semiconductor device
SAMSUNG ELECTRONICS CO LTD8 citations84
US7834391B2Nov 16, 2010
Integrated circuit memory devices including memory cells on adjacent pedestals having different heights, and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD8 citations84
US7804137B2Sep 28, 2010
Field effect transistor (FET) devices and methods of manufacturing FET devices
SAMSUNG ELECTRONICS CO LTD12 citations84
US7566619B2Jul 28, 2009
Methods of forming integrated circuit devices having field effect transistors of different types in different device regions
SAMSUNG ELECTRONICS CO LTD12 citations84
US7528022B2May 5, 2009
Method of forming fin field effect transistor using damascene process
SAMSUNG ELECTRONICS CO LTD11 citations84
US7329581B2Feb 12, 2008
Field effect transistor (FET) devices and methods of manufacturing FET devices
SAMSUNG ELECTRONICS CO LTD12 citations84
US7166514B2Jan 23, 2007
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD15 citations84
US9299811B2Mar 29, 2016
Methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations83
US7978522B2Jul 12, 2011
Flash memory device including a dummy cell
SAMSUNG ELECTRONICS CO LTD6 citations74
US7560759B2Jul 14, 2009
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US10269928B2Apr 23, 2019
Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels
SAMSUNG ELECTRONICS CO LTD3 citations72
US10205023B2Feb 12, 2019
Semiconductor device including multi-channel active patterns
SAMSUNG ELECTRONICS CO LTD2 citations72
US10002943B2Jun 19, 2018
Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels
SAMSUNG ELECTRONICS CO LTD4 citations72
US9755074B2Sep 5, 2017
Semiconductor device including a multi-channel active pattern
SAMSUNG ELECTRONICS CO LTD3 citations72
US7982246B2Jul 19, 2011
Selection transistor
SAMSUNG ELECTRONICS CO LTD2 citations63
US7384850B2Jun 10, 2008
Methods of forming complementary metal oxide semiconductor (CMOS) transistors having three-dimensional channel regions therein
SAMSUNG ELECTRONICS CO LTD5 citations63
US12336242B2Jun 17, 2025
Semiconductor devices including protruding insulation portions between active fins
SAMSUNG ELECTRONICS CO LTD0 citations62
US11955517B2Apr 9, 2024
Semiconductor devices including protruding insulation portions between active fins
SAMSUNG ELECTRONICS CO LTD0 citations62
US10861934B2Dec 8, 2020
Semiconductor devices including protruding insulation portions between active fins
SAMSUNG ELECTRONICS CO LTD0 citations52
US10319814B2Jun 11, 2019
Semiconductor devices including protruding insulation portions between active fins
SAMSUNG ELECTRONICS CO LTD0 citations52
US8044453B2Oct 25, 2011
Non-volatile memory device with a charge trapping layer
SAMSUNG ELECTRONICS CO LTD0 citations52
US7955884B2Jun 7, 2011
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations52
US7936600B2May 3, 2011
Methods of programming data in a non-volatile memory device with a fringe voltage applied to conductive layer
SAMSUNG ELECTRONICS CO LTD0 citations52
US7911847B2Mar 22, 2011
Method of programming data in a NAND flash memory device and method of reading data in the NAND flash memory device
SAMSUNG ELECTRONICS CO LTD1 citations52
US7884425B2Feb 8, 2011
Non-volatile memory devices
SAMSUNG ELECTRONICS CO LTD0 citations52
US8035152B2Oct 11, 2011
Semiconductor device having shared bit line structure
SAMSUNG ELECTRONICS CO LTD0 citations51
MAEDA SHIGENOBU
3 patentsUS8836046B2Sep 16, 2014
Semiconductor devices including protruding insulation portions between active fins
MAEDA SHIGENOBU19 citations92
US9419077B2Aug 16, 2016
Semiconductor devices including protruding insulation portions between active fins
MAEDA SHIGENOBU1 citations62
US9627483B2Apr 18, 2017
Semiconductor devices including protruding insulation portions between active fins
MAEDA SHIGENOBU0 citations52
KANG HEE-SOO
3 patentsUS8208301B2Jun 26, 2012
Nonvolatile memory devices having common bit line structure
KANG HEE-SOO4 citations60
US8158480B2Apr 17, 2012
Method of forming a pattern for a semiconductor device, method of forming a charge storage pattern using the same method, non-volatile memory device and methods of manufacturing the same
KANG HEE-SOO2 citations60
US8422290B2Apr 16, 2013
Methods of reading data in a NAND flash memory device with a fringe voltage applied to a conductive layer
KANG HEE-SOO0 citations50