P

Inventor

KANG HEE-SOO

KR44 patents
⚠️ This page may combine multiple inventors who share the name “KANG HEE-SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

32 patents
US8878309B1Nov 4, 2014

Semiconductor device having 3D channels, and methods of fabricating semiconductor devices having 3D channels

SAMSUNG ELECTRONICS CO LTD105 citations97
US9379106B2Jun 28, 2016

Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels

SAMSUNG ELECTRONICS CO LTD18 citations92
US8053347B2Nov 8, 2011

Method of manufacturing semiconductor device

SAMSUNG ELECTRONICS CO LTD25 citations92
US7358142B2Apr 15, 2008

Method for forming a FinFET by a damascene process

SAMSUNG ELECTRONICS CO LTD29 citations92
US7056781B2Jun 6, 2006

Method of forming fin field effect transistor

SAMSUNG ELECTRONICS CO LTD51 citations92
US9012281B2Apr 21, 2015

Semiconductor device fabrication methods

SAMSUNG ELECTRONICS CO LTD14 citations84
US7868467B2Jan 11, 2011

Semiconductor device

SAMSUNG ELECTRONICS CO LTD8 citations84
US7834391B2Nov 16, 2010

Integrated circuit memory devices including memory cells on adjacent pedestals having different heights, and methods of fabricating same

SAMSUNG ELECTRONICS CO LTD8 citations84
US7804137B2Sep 28, 2010

Field effect transistor (FET) devices and methods of manufacturing FET devices

SAMSUNG ELECTRONICS CO LTD12 citations84
US7566619B2Jul 28, 2009

Methods of forming integrated circuit devices having field effect transistors of different types in different device regions

SAMSUNG ELECTRONICS CO LTD12 citations84
US7528022B2May 5, 2009

Method of forming fin field effect transistor using damascene process

SAMSUNG ELECTRONICS CO LTD11 citations84
US7329581B2Feb 12, 2008

Field effect transistor (FET) devices and methods of manufacturing FET devices

SAMSUNG ELECTRONICS CO LTD12 citations84
US7166514B2Jan 23, 2007

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD15 citations84
US9299811B2Mar 29, 2016

Methods of fabricating semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations83
US7978522B2Jul 12, 2011

Flash memory device including a dummy cell

SAMSUNG ELECTRONICS CO LTD6 citations74
US7560759B2Jul 14, 2009

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US10269928B2Apr 23, 2019

Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels

SAMSUNG ELECTRONICS CO LTD3 citations72
US10205023B2Feb 12, 2019

Semiconductor device including multi-channel active patterns

SAMSUNG ELECTRONICS CO LTD2 citations72
US10002943B2Jun 19, 2018

Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels

SAMSUNG ELECTRONICS CO LTD4 citations72
US9755074B2Sep 5, 2017

Semiconductor device including a multi-channel active pattern

SAMSUNG ELECTRONICS CO LTD3 citations72
US7982246B2Jul 19, 2011

Selection transistor

SAMSUNG ELECTRONICS CO LTD2 citations63
US7384850B2Jun 10, 2008

Methods of forming complementary metal oxide semiconductor (CMOS) transistors having three-dimensional channel regions therein

SAMSUNG ELECTRONICS CO LTD5 citations63
US12336242B2Jun 17, 2025

Semiconductor devices including protruding insulation portions between active fins

SAMSUNG ELECTRONICS CO LTD0 citations62
US11955517B2Apr 9, 2024

Semiconductor devices including protruding insulation portions between active fins

SAMSUNG ELECTRONICS CO LTD0 citations62
US10861934B2Dec 8, 2020

Semiconductor devices including protruding insulation portions between active fins

SAMSUNG ELECTRONICS CO LTD0 citations52
US10319814B2Jun 11, 2019

Semiconductor devices including protruding insulation portions between active fins

SAMSUNG ELECTRONICS CO LTD0 citations52
US8044453B2Oct 25, 2011

Non-volatile memory device with a charge trapping layer

SAMSUNG ELECTRONICS CO LTD0 citations52
US7955884B2Jun 7, 2011

Semiconductor packages

SAMSUNG ELECTRONICS CO LTD1 citations52
US7936600B2May 3, 2011

Methods of programming data in a non-volatile memory device with a fringe voltage applied to conductive layer

SAMSUNG ELECTRONICS CO LTD0 citations52
US7911847B2Mar 22, 2011

Method of programming data in a NAND flash memory device and method of reading data in the NAND flash memory device

SAMSUNG ELECTRONICS CO LTD1 citations52
US7884425B2Feb 8, 2011

Non-volatile memory devices

SAMSUNG ELECTRONICS CO LTD0 citations52
US8035152B2Oct 11, 2011

Semiconductor device having shared bit line structure

SAMSUNG ELECTRONICS CO LTD0 citations51

MAEDA SHIGENOBU

3 patents

KANG HEE-SOO

3 patents

SUNG SUK-KANG

2 patents

YOON YOUNG-BAE

1 patent

SEL JONG-SUN

1 patent

JANG DONG-HOON

1 patent

KIM HA NEUL

1 patent