Inventor
SUGIURA KAZUHIKO
JP36 patents
⚠️ This page may combine multiple inventors who share the name “SUGIURA KAZUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
23 patentsUS6207302B1Mar 27, 2001
Electroluminescent device and method of producing the same
DENSO CORP207 citations99
US7859091B2Dec 28, 2010
Manufacturing methods for semiconductor device with sealed cap
DENSO CORP17 citations92
US7821085B2Oct 26, 2010
Physical quantity sensor and method for manufacturing the same
DENSO CORP26 citations92
US7214625B2May 8, 2007
Method for manufacturing movable portion of semiconductor device
DENSO CORP22 citations92
US7901967B2Mar 8, 2011
Dicing method for semiconductor substrate
DENSO CORP20 citations90
US8941122B2Jan 27, 2015
Silicon carbide semiconductor device and method of manufacturing the same
DENSO CORP7 citations84
US7968958B2Jun 28, 2011
Semiconductor device and manufacturing method of the same
DENSO CORP9 citations84
US7157781B2Jan 2, 2007
Enhancement of membrane characteristics in semiconductor device with membrane
DENSO CORP11 citations83
US9263267B2Feb 16, 2016
Silicon carbide semiconductor device and method of manufacturing the same
DENSO CORP3 citations73
US9105558B2Aug 11, 2015
Silicon carbide semiconductor device and manufacturing method of the same
DENSO CORP4 citations73
US7598118B2Oct 6, 2009
Method of manufacturing semiconductor sensor
DENSO CORP7 citations73
US8349634B2Jan 8, 2013
Semiconductor device with sealed cap
DENSO CORP2 citations63
US11189493B2Nov 30, 2021
Silicon carbide semiconductor device and method for manufacturing the same
DENSO CORP0 citations62
US8785231B2Jul 22, 2014
Method of making semiconductor device
DENSO CORP2 citations62
US7662668B2Feb 16, 2010
Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate
DENSO CORP3 citations62
US11101246B2Aug 24, 2021
Semiconductor device having chips attached to support members through silver sintered bodies with particles
DENSO CORP1 citations61
US10804237B2Oct 13, 2020
Semiconductor device
DENSO CORP0 citations51
US10943847B2Mar 9, 2021
Semiconductor chip and semiconductor device
DENSO CORP0 citations50
US10763204B2Sep 1, 2020
Semiconductor device
DENSO CORP0 citations49
US8728923B2May 20, 2014
Manufacturing method of semiconductor device
DENSO CORP1 citations48
US10361274B2Jul 23, 2019
Silicon carbide semiconductor device having metal silicide surrounds a peripheral of metal carbide
DENSO CORP0 citations44
US9997432B2Jun 12, 2018
Semiconductor device and electronic component using the same
DENSO CORP0 citations42
US7547642B2Jun 16, 2009
Micro-structure manufacturing method
DENSO CORP0 citations42
NIPPON DENSO CO
4 patentsUS6090434AJul 18, 2000
Method for fabricating electroluminescent device
NIPPON DENSO CO25 citations92
US5714274AFeb 3, 1998
Electroluminescent device and method for producing the same
NIPPON DENSO CO30 citations92
US5712051AJan 27, 1998
Electroluminescent device and method for fabricating same
NIPPON DENSO CO5 citations74
US5667607ASep 16, 1997
Process for fabricating electroluminescent device
NIPPON DENSO CO15 citations74
SUGIURA KAZUHIKO
4 patentsUS8146426B2Apr 3, 2012
Physical sensor
SUGIURA KAZUHIKO7 citations82
US8269290B2Sep 18, 2012
Semiconductor device including a plurality of semiconductor substrates and method of manufacturing the same
SUGIURA KAZUHIKO4 citations61
US10441618B2Oct 15, 2019
Moringa extract
SUGIURA KAZUHIKO0 citations50
US8726268B2May 13, 2014
Computer-readable medium, information processing apparatus, display control method
SUGIURA KAZUHIKO0 citations40