Inventor
TATSUMI KOHEI
JP27 patents
⚠️ This page may combine multiple inventors who share the name “TATSUMI KOHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON STEEL CORP
15 patentsUS5687901ANov 18, 1997
Process and apparatus for forming ball bumps
NIPPON STEEL CORP54 citations93
US5639558AJun 17, 1997
Insulating resin-coated bonding wire
NIPPON STEEL CORP27 citations90
US5857610AJan 12, 1999
Process and apparatus for forming ball bumps
NIPPON STEEL CORP22 citations89
US7969021B2Jun 28, 2011
Bonding wire for semiconductor device and method for producing the same
NIPPON STEEL CORP12 citations84
US6210637B1Apr 3, 2001
Gold alloy thin wire for semiconductor devices
NIPPON STEEL CORP10 citations74
US7390370B2Jun 24, 2008
Gold bonding wires for semiconductor devices and method of producing the wires
NIPPON STEEL CORP6 citations73
US7045388B2May 16, 2006
Semiconductor device provided with low melting point metal bumps
NIPPON STEEL CORP6 citations73
US7045389B1May 16, 2006
Method for fabricating a semiconductor devices provided with low melting point metal bumps
NIPPON STEEL CORP9 citations73
US6916731B2Jul 12, 2005
Ball transferring method and apparatus
NIPPON STEEL CORP8 citations73
US6571007B1May 27, 2003
Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method
NIPPON STEEL CORP11 citations73
US6509645B2Jan 21, 2003
Spherical semiconductor device and method for fabricating the same
NIPPON STEEL CORP10 citations73
US5803339ASep 8, 1998
Process and apparatus for forming ball bumps
NIPPON STEEL CORP9 citations71
US6080492AJun 27, 2000
Gold alloy thin wire for semiconductor devices
NIPPON STEEL CORP1 citations52
US6884708B2Apr 26, 2005
Method of partially plating substrate for electronic devices
NIPPON STEEL CORP0 citations51
US8044408B2Oct 25, 2011
SiC single-crystal substrate and method of producing SiC single-crystal substrate
NIPPON STEEL CORP0 citations49
UNIV WASEDA
4 patentsUS11810885B2Nov 7, 2023
Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agent
UNIV WASEDA0 citations62
US10903146B2Jan 26, 2021
Electrode connection structure, lead frame, and method for forming electrode connection structure
UNIV WASEDA0 citations62
US11152286B2Oct 19, 2021
Power semiconductor module device
UNIV WASEDA0 citations52
US9601448B2Mar 21, 2017
Electrode connection structure and electrode connection method
UNIV WASEDA0 citations52