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Inventor
YANO TETSURO
JP
2 patents
Patents
2 patents
US7405478B2
Jul 29, 2008
Substrate package structure and packaging method thereof
DENSO CORP
20 citations
89
US7005313B2
Feb 28, 2006
Semiconductor dynamic sensor, and methods of transport and collet suction for the same
DENSO CORP
0 citations
48