Inventor
LEE KUO-YUAN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “LEE KUO-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LEE KUO-YUAN
3 patentsUS8093104B1Jan 10, 2012
Multi-chip stacking method to reduce voids between stacked chips
LEE KUO-YUAN9 citations79
US8112854B2Feb 14, 2012
Tool holding device for a five-axis lathe
LEE KUO-YUAN3 citations58
US8815645B2Aug 26, 2014
Multi-chip stacking method to reduce voids between stacked chips
LEE KUO-YUAN1 citations48
WALTON ADVANCED ENG INC
3 patentsUS7768112B2Aug 3, 2010
Semiconductor package fabricated by cutting and molding in small windows
WALTON ADVANCED ENG INC4 citations61
US7723157B2May 25, 2010
Method for cutting and molding in small windows to fabricate semiconductor packages
WALTON ADVANCED ENG INC3 citations61
US8361841B2Jan 29, 2013
Mold array process method to encapsulate substrate cut edges
WALTON ADVANCED ENG INC1 citations49