Inventor
SEKINE NAOKI
JP19 patents
⚠️ This page may combine multiple inventors who share the name “SEKINE NAOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
10 patentsUS9793236B2Oct 17, 2017
Wire-bonding apparatus and method of manufacturing semiconductor device
SHINKAWA KK7 citations82
US9457421B2Oct 4, 2016
Wire-bonding apparatus and method of wire bonding
SHINKAWA KK7 citations82
US9337166B2May 10, 2016
Wire bonding apparatus and bonding method
SHINKAWA KK9 citations82
US9899348B2Feb 20, 2018
Wire bonding apparatus and method of manufacturing semiconductor device
SHINKAWA KK4 citations72
US9887174B2Feb 6, 2018
Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus
SHINKAWA KK3 citations72
US9368471B2Jun 14, 2016
Wire-bonding apparatus and method of manufacturing semiconductor device
SHINKAWA KK3 citations71
US9379086B2Jun 28, 2016
Method of manufacturing semiconductor device
SHINKAWA KK4 citations67
US11961819B2Apr 16, 2024
Wire bonding apparatus
SHINKAWA KK0 citations62
US9978713B2May 22, 2018
Method of manufacturing semiconductor device and wire bonding apparatus
SHINKAWA KK0 citations50
US10566307B2Feb 18, 2020
Manufacturing method of semiconductor device
SHINKAWA KK0 citations37
TOSHIBA TEC KK
4 patentsUS11468902B2Oct 11, 2022
Voice recognition device and voice recognition method
TOSHIBA TEC KK0 citations62
US11615146B2Mar 28, 2023
Information processing device, information processing system, and control method thereof
TOSHIBA TEC KK0 citations53
US10600422B2Mar 24, 2020
Voice recognition device configured to start voice recognition in response to user instruction
TOSHIBA TEC KK0 citations51
US12417765B2Sep 16, 2025
Conference server and conference system
TOSHIBA TEC KK0 citations43