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Inventor
BULEY TODD H
US
2 patents
Patents
2 patents
US6711810B2
Mar 30, 2004
Method of assembling a land grid array module
IBM
21 citations
89
US6974071B2
Dec 13, 2005
Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
IBM
8 citations
69