Inventor

LIU AN-HONG

TW32 patents

⚠️ This page may combine multiple inventors who share the name “LIU AN-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU AN-HONG

CHIPMOS TECHNOLOGIES INC

Semiconductor wafer designed to avoid probed marks while testing

Modularized probe card for high frequency probing

Modularized probe head

Probe card assembly

Semiconductor package structure and method for manufacturing the same

Manufacturing process of semiconductor devices

COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Method for fabricating anisotropic conductive substrate

Wafer level packaging for making flip-chips

Method and system for performing memory repair analysis

Method for fabricating a plurality of elastic probes in a row

Thermally enhanced electronic package

Method for manufacturing probes of a probe card

CHIPMOS TECHNOLOGIES BERMUDA

Probe card assembly

Modular probe card assembly

Flip-chip type semiconductor device for reducing signal skew

High frequency IC package and method for fabricating the same

Image sensor assembly and method for fabricating the same

Modular probe card

Modularized probe card with coaxial transmitters

Method for fabricating a plurality of elastic probes in a row

Pillar grid array package

Electronic device with a warped spring connector

Method of manufacturing an injector plate

WANG DAVID WEI

Multi-chip stack package structure

Multi-chip stack package structure

Multi-chip stack package structure

CHIPMOS TECHNOLOGIES LTD

Modularized probe card with compressible electrical connection device

CHIPMOS TECHNOLOGIES BERMEDA L

Multi-chip image sensor module

HUANG TZU HSIN

Thermally enhanced electronic package

LIU AN HONG

Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same

HUANG CHENG-FANG

RFID real-time information system accommodated to semiconductor supply chain