Inventor
HUANG HSIANG-MING
TW13 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HSIANG-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES BERMUDA
4 patentsUS7554197B2Jun 30, 2009
High frequency IC package and method for fabricating the same
CHIPMOS TECHNOLOGIES BERMUDA14 citations83
US7372286B2May 13, 2008
Modular probe card
CHIPMOS TECHNOLOGIES BERMUDA17 citations83
US7316065B2Jan 8, 2008
Method for fabricating a plurality of elastic probes in a row
CHIPMOS TECHNOLOGIES BERMUDA4 citations62
US7368809B2May 6, 2008
Pillar grid array package
CHIPMOS TECHNOLOGIES BERMUDA4 citations61
CHIPMOS TECHNOLOGIES INC
3 patentsUS7973310B2Jul 5, 2011
Semiconductor package structure and method for manufacturing the same
CHIPMOS TECHNOLOGIES INC37 citations89
US7642639B2Jan 5, 2010
COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
CHIPMOS TECHNOLOGIES INC3 citations62
US7477065B2Jan 13, 2009
Method for fabricating a plurality of elastic probes in a row
CHIPMOS TECHNOLOGIES INC1 citations51