Inventor

YANG JAR-DAR

TW3 patents

Patents

3 patents

US8269352B2Sep 18, 2012

Multi-chip stack package structure

WANG DAVID WEI10 citations81

US8269351B2Sep 18, 2012

Multi-chip stack package structure

WANG DAVID WEI2 citations60

US8264068B2Sep 11, 2012

Multi-chip stack package structure

WANG DAVID WEI2 citations60