P

Inventor

YAMAMOTO KAZUNORI

JP89 patents
⚠️ This page may combine multiple inventors who share the name “YAMAMOTO KAZUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

16 patents
US6265782B1Jul 24, 2001

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

HITACHI CHEMICAL CO LTD99 citations97
US6223429B1May 1, 2001

Method of production of semiconductor device

HITACHI CHEMICAL CO LTD145 citations97
US6673441B1Jan 6, 2004

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

HITACHI CHEMICAL CO LTD55 citations96
US6328844B1Dec 11, 2001

Filmy adhesive for connecting circuits and circuit board

HITACHI CHEMICAL CO LTD53 citations96
US6184577B1Feb 6, 2001

Electronic component parts device

HITACHI CHEMICAL CO LTD62 citations96
US6090468AJul 18, 2000

Multilayer wiring board for mounting semiconductor device and method of producing the same

HITACHI CHEMICAL CO LTD63 citations96
US5690837ANov 25, 1997

Process for producing multilayer printed circuit board

HITACHI CHEMICAL CO LTD55 citations95
US6838170B2Jan 4, 2005

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

HITACHI CHEMICAL CO LTD24 citations92
US6621170B2Sep 16, 2003

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

HITACHI CHEMICAL CO LTD29 citations92
US5965269AOct 12, 1999

Adhesive, adhesive film and adhesive-backed metal foil

HITACHI CHEMICAL CO LTD40 citations92
US7239013B2Jul 3, 2007

Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device

HITACHI CHEMICAL CO LTD16 citations91
US7700185B2Apr 20, 2010

Insulation material, film, circuit board and method of producing them

HITACHI CHEMICAL CO LTD9 citations84
US6197149B1Mar 6, 2001

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

HITACHI CHEMICAL CO LTD15 citations84
US7592250B2Sep 22, 2009

Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device

HITACHI CHEMICAL CO LTD10 citations82
US6889431B2May 10, 2005

Manufacturing method of electronic circuit including multilayer circuit board

HITACHI CHEMICAL CO LTD11 citations73
US5885723AMar 23, 1999

Bonding film for printed circuit boards

HITACHI CHEMICAL CO LTD12 citations71

FUMAKILLA LTD

11 patents

FUJITSU LTD

6 patents

YAMAMOTO KAZUNORI

5 patents

DORYOKURO KAKUNENRYO

3 patents

HITACHI SUMITOMO HEAVY IND CONSTRUCTION CRANE CO LTD

2 patents

TOYO JIDOKI KK

2 patents

HONDA MOTOR CO LTD

1 patent

YAMASAKI SATOSHI

1 patent

FUKEDA SHINICHI

1 patent

KONISHIROKU PHOTO IND

1 patent

NITTO ELECTRIC IND CO

1 patent

Showing the top 50 of 89 patents by PatentIndex Score.