Inventor
LAI YA-YI
TW5 patents
⚠️ This page may combine multiple inventors who share the name “LAI YA-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS7019389B2Mar 28, 2006
Lead frame and semiconductor package with the same
SILICONWARE PRECISION INDUSTRIES CO LTD23 citations88
US6414379B1Jul 2, 2002
Structure of disturbing plate having down set
SILICONWARE PRECISION INDUSTRIES CO LTD17 citations78
US9524944B2Dec 20, 2016
Method for fabricating package structure
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations66
US6642735B2Nov 4, 2003
Semiconductor package for chip with testing contact pad connected to outside
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations59