Inventor

SHI LAN

JP2 patents

⚠️ This page may combine multiple inventors who share the name “SHI LAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI GLOBAL STORAGE TECH

1 patent

US6742694B2Jun 1, 2004

Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus

HITACHI GLOBAL STORAGE TECH32 citations89

UNIV FUDAN

1 patent

US11193845B2Dec 7, 2021

Ultrahigh sensitive pressure-sensing film based on spiky hollow carbon spheres and the fabrication method thereof

UNIV FUDAN0 citations55