Inventor
LEE HYO-SAN
KR38 patents
⚠️ This page may combine multiple inventors who share the name “LEE HYO-SAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
27 patentsUS8344385B2Jan 1, 2013
Vertical-type semiconductor device
SAMSUNG ELECTRONICS CO LTD43 citations94
US7176041B2Feb 13, 2007
PAA-based etchant, methods of using same, and resultant structures
SAMSUNG ELECTRONICS CO LTD32 citations92
US7709277B2May 4, 2010
PAA-based etchant, methods of using same, and resultant structures
SAMSUNG ELECTRONICS CO LTD22 citations89
US10679843B2Jun 9, 2020
Method of treating substrates using supercritical fluids
SAMSUNG ELECTRONICS CO LTD7 citations84
US10029332B2Jul 24, 2018
Spot heater and device for cleaning wafer using the same
SAMSUNG ELECTRONICS CO LTD6 citations83
US10083829B2Sep 25, 2018
Apparatus for treating substrates using supercritical fluids, substrate treatment system including the same and method of treating substrates using the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US10576582B2Mar 3, 2020
Spot heater and device for cleaning wafer using the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11142694B2Oct 12, 2021
Etchant composition and method of fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations70
US10525566B2Jan 7, 2020
Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same
SAMSUNG ELECTRONICS CO LTD2 citations65
US7857939B2Dec 28, 2010
Apparatus for treating wafers using supercritical fluid
SAMSUNG ELECTRONICS CO LTD4 citations63
US11227761B2Jan 18, 2022
Method of removing chemicals from a substrate
SAMSUNG ELECTRONICS CO LTD0 citations62
US12590249B2Mar 31, 2026
Etchant composition
SAMSUNG ELECTRONICS CO LTD0 citations60
US12534819B2Jan 27, 2026
Cerium oxide nanoparticles, methods for fabricating the same and methods for fabricating a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US12543337B2Feb 3, 2026
Oxide film coating solution and semiconductor device manufacturing method using the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US10395951B2Aug 27, 2019
Method of cleaning a substrate and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD1 citations58
US12297385B2May 13, 2025
Etching compositions and methods for fabricating semiconductor devices by using the same
SAMSUNG ELECTRONICS CO LTD0 citations56
US12046464B2Jul 23, 2024
Substrate cleaning composition, method for cleaning substrate using the same, and method for fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations56
US9754806B2Sep 5, 2017
Apparatus for treating wafers using supercritical fluid
SAMSUNG ELECTRONICS CO LTD0 citations52
US9394509B2Jul 19, 2016
Cleaning solution composition and method of cleaning semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7959738B2Jun 14, 2011
Method of removing photoresist and method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US10795263B2Oct 6, 2020
Compositions for removing photoresist
SAMSUNG ELECTRONICS CO LTD0 citations49
US10025192B2Jul 17, 2018
Methods of manufacturing semiconductor devices using a composition for removing photoresist and methods of removing photoresist from a semiconductor substrate
SAMSUNG ELECTRONICS CO LTD0 citations49
US11149234B2Oct 19, 2021
Cleaning composition, cleaning apparatus, and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12476114B2Nov 18, 2025
Chemical mechanical polishing method and method for fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations46
US11676824B2Jun 13, 2023
Chemical mechanical polishing apparatus for controlling polishing uniformity
SAMSUNG ELECTRONICS CO LTD0 citations44
US10332762B2Jun 25, 2019
Chemical liquid supply apparatus and semiconductor processing apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations41
US10668403B2Jun 2, 2020
Source supplier for a supercritical fluid, substrate processing apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations39
LEE HYO-SAN
6 patentsUS8790470B2Jul 29, 2014
Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods
LEE HYO-SAN8 citations81
US8585917B2Nov 19, 2013
Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods
LEE HYO-SAN5 citations81
US8084367B2Dec 27, 2011
Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods
LEE HYO-SAN9 citations81
US8951383B2Feb 10, 2015
Apparatus for treating wafers using supercritical fluid
LEE HYO-SAN2 citations62
US8557651B2Oct 15, 2013
Method of manufacturing a semiconductor device using an etchant
LEE HYO-SAN2 citations62
US8211804B2Jul 3, 2012
Methods of forming a hole having a vertical profile and semiconductor devices having a vertical hole
LEE HYO-SAN2 citations61