Inventor
SYU SHIH-YI
TW10 patents
⚠️ This page may combine multiple inventors who share the name “SYU SHIH-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS10290559B2May 14, 2019
Thermal dissipation through seal rings in 3DIC structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US9490190B2Nov 8, 2016
Thermal dissipation through seal rings in 3DIC structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11037854B2Jun 15, 2021
Thermal dissipation through seal rings in 3DIC structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10535580B2Jan 14, 2020
Thermal dissipation through seal rings in 3DIC structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11848247B2Dec 19, 2023
Thermal dissipation through seal rings in 3DIC structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
MEDIATEK INC
3 patentsUS9704808B2Jul 11, 2017
Semiconductor device and wafer level package including such semiconductor device
MEDIATEK INC2 citations72
US10515887B2Dec 24, 2019
Fan-out package structure having stacked carrier substrates and method for forming the same
MEDIATEK INC3 citations71
US10224287B2Mar 5, 2019
Semiconductor device and wafer level package including such semiconductor device
MEDIATEK INC1 citations61