Inventor
LEE LONG HUA
TW17 patents
⚠️ This page may combine multiple inventors who share the name “LEE LONG HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11075133B2Jul 27, 2021
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11621205B2Apr 4, 2023
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11024616B2Jun 1, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10510595B2Dec 17, 2019
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10157879B2Dec 18, 2018
Die-to-die gap control for semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12148661B2Nov 19, 2024
Method of forming integrated fan-out packages with built-in heat sink
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080617B2Sep 3, 2024
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11842936B2Dec 12, 2023
Underfill structure for semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11257715B2Feb 22, 2022
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11201097B2Dec 14, 2021
Method of manufacture of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11121050B2Sep 14, 2021
Method of manufacture of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62