P

Inventor

HWANG HOW YUAN

MY7 patents
⚠️ This page may combine multiple inventors who share the name “HWANG HOW YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST MICROELECTRONICS PTE LTD

3 patents
US9318459B2Apr 19, 2016

Through via package

ST MICROELECTRONICS PTE LTD2 citations59
US8836117B2Sep 16, 2014

Electronic device having a contact recess and related methods

ST MICROELECTRONICS PTE LTD0 citations50
US8822267B2Sep 2, 2014

System in package manufacturing method using wafer-to-wafer bonding

ST MICROELECTRONICS PTE LTD0 citations41

AGENCY SCIENCE TECH & RES

2 patents
US9841399B2Dec 12, 2017

Chemical sensor package for highly pressured environment

AGENCY SCIENCE TECH & RES0 citations42
US9431315B2Aug 30, 2016

Chemical sensor package for highly pressured environment

AGENCY SCIENCE TECH & RES1 citations42

HWANG HOW YUAN

1 patent
US8922013B2Dec 30, 2014

Through via package

HWANG HOW YUAN5 citations76

OIP TECH PTE LTD

1 patent
US12554079B2Feb 17, 2026

Integrated photonics package and method of forming same

OIP TECH PTE LTD0 citations55