Inventor
HUANG YAOHUANG
SG7 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YAOHUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GAN KAH WEE
4 patentsUS8916481B2Dec 23, 2014
Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
GAN KAH WEE33 citations92
US8779601B2Jul 15, 2014
Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
GAN KAH WEE34 citations92
US8617987B2Dec 31, 2013
Through hole via filling using electroless plating
GAN KAH WEE7 citations82
US8766422B2Jul 1, 2014
Through hole via filling using electroless plating
GAN KAH WEE3 citations61
ST MICROELECTRONICS PTE LTD
2 patentsUS8860228B2Oct 14, 2014
Electronic device including electrically conductive vias having different cross-sectional areas and related methods
ST MICROELECTRONICS PTE LTD1 citations51
US8822267B2Sep 2, 2014
System in package manufacturing method using wafer-to-wafer bonding
ST MICROELECTRONICS PTE LTD0 citations41