Inventor
GOH KIM-YONG
SG24 patents
⚠️ This page may combine multiple inventors who share the name “GOH KIM-YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GOH KIM-YONG
9 patentsUS8884422B2Nov 11, 2014
Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture
GOH KIM-YONG46 citations93
US8436255B2May 7, 2013
Fan-out wafer level package with polymeric layer for high reliability
GOH KIM-YONG40 citations93
US8466997B2Jun 18, 2013
Fan-out wafer level package for an optical sensor and method of manufacture thereof
GOH KIM-YONG8 citations83
US8389335B2Mar 5, 2013
Chip Scale Package structure with can attachment
GOH KIM-YONG7 citations83
US8502394B2Aug 6, 2013
Multi-stacked semiconductor dice scale package structure and method of manufacturing same
GOH KIM-YONG5 citations72
US8164179B2Apr 24, 2012
Chip scale package structure with can attachment
GOH KIM-YONG3 citations62
US8637352B2Jan 28, 2014
Ball grid array to pin grid array conversion
GOH KIM-YONG0 citations51
US8410598B2Apr 2, 2013
Semiconductor package and method of manufacturing the same
GOH KIM-YONG1 citations51
US8642396B2Feb 4, 2014
Ultra-thin quad flat no-lead (QFN) package
GOH KIM-YONG1 citations50
ST MICROELECTRONICS PTE LTD
8 patentsUS9449912B1Sep 20, 2016
Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
ST MICROELECTRONICS PTE LTD11 citations82
US9576912B1Feb 21, 2017
Wafer level chip scale package (WLCSP) having edge protection
ST MICROELECTRONICS PTE LTD4 citations71
US10658238B2May 19, 2020
Semiconductor packages having an electric device with a recess
ST MICROELECTRONICS PTE LTD0 citations51
US9824924B2Nov 21, 2017
Semiconductor packages having an electric device with a recess
ST MICROELECTRONICS PTE LTD0 citations51
US9379034B1Jun 28, 2016
Method of making an electronic device including two-step encapsulation and related devices
ST MICROELECTRONICS PTE LTD1 citations51
US8907465B2Dec 9, 2014
Methods and devices for packaging integrated circuits
ST MICROELECTRONICS PTE LTD0 citations45
US8822267B2Sep 2, 2014
System in package manufacturing method using wafer-to-wafer bonding
ST MICROELECTRONICS PTE LTD0 citations41
US9679870B2Jun 13, 2017
Integrated circuit device with shaped leads and method of forming the device
ST MICROELECTRONICS PTE LTD0 citations36