Inventor

HWUNG YA-HSI

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HWUNG YA-HSI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN JING-CHENG

1 patent

US8922004B2Dec 30, 2014

Copper bump structures having sidewall protection layers

LIN JING-CHENG9 citations83

TAIWAN SEMICONDUCTOR MFG

1 patent

US9093314B2Jul 28, 2015

Copper bump structures having sidewall protection layers

TAIWAN SEMICONDUCTOR MFG3 citations61