Inventor
Lin yan-fu
TW10 patents
⚠️ This page may combine multiple inventors who share the name “Lin yan-fu”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS10163802B2Dec 25, 2018
Fan-out package having a main die and a dummy die, and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD76 citations97
US10510674B2Dec 17, 2019
Fan-out package having a main die and a dummy die, and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations94
US11094641B2Aug 17, 2021
Fan-out package having a main die and a dummy die
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9812426B1Nov 7, 2017
Integrated fan-out package, semiconductor device, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations83
US11967563B2Apr 23, 2024
Fan-out package having a main die and a dummy die
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12224247B2Feb 11, 2025
Fan-out package having a main die and a dummy die
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9852957B2Dec 26, 2017
Testing, manufacturing, and packaging methods for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49