Inventor

LEE SANGDO

CN2 patents

⚠️ This page may combine multiple inventors who share the name “LEE SANGDO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FAIRCHILD SEMICONDUCTOR

1 patent

US7564124B2Jul 21, 2009

Semiconductor die package including stacked dice and heat sink structures

FAIRCHILD SEMICONDUCTOR13 citations79

LEE SANGDO

1 patent

US8084870B2Dec 27, 2011

Semiconductor devices and electrical parts manufacturing using metal coated wires

LEE SANGDO2 citations47