P

Inventor

LIM ZHENG-YI

TW13 patents
⚠️ This page may combine multiple inventors who share the name “LIM ZHENG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

4 patents
US10483230B2Nov 19, 2019

Bonding package components through plating

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US9691738B2Jun 27, 2017

Bonding package components through plating

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9953891B2Apr 24, 2018

Method of forming post-passivation interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10840212B2Nov 17, 2020

Bonding package components through plating

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

HWANG CHIEN LING

2 patents
US8258055B2Sep 4, 2012

Method of forming semiconductor die

HWANG CHIEN LING38 citations92
US9048135B2Jun 2, 2015

Copper pillar bump with cobalt-containing sidewall protection

HWANG CHIEN LING12 citations83

LIM ZHENG-YI

2 patents
US8242011B2Aug 14, 2012

Method of forming metal pillar

LIM ZHENG-YI23 citations89
US9117772B2Aug 25, 2015

Bonding package components through plating

LIM ZHENG-YI0 citations49

WU YI-WEN

2 patents
US9099396B2Aug 4, 2015

Post-passivation interconnect structure and method of forming the same

WU YI-WEN8 citations83
US8865586B2Oct 21, 2014

UBM formation for integrated circuits

WU YI-WEN3 citations62

CHENG MING-DA

2 patents
US8227334B2Jul 24, 2012

Doping minor elements into metal bumps

CHENG MING-DA3 citations62
US8501615B2Aug 6, 2013

Metal bump formation

CHENG MING-DA0 citations51

TAIWAN SEMICONDUCTOR MFG

1 patent
US9275965B2Mar 1, 2016

Copper pillar bump with cobalt-containing sidewall protection layer

TAIWAN SEMICONDUCTOR MFG1 citations52