P

Inventor

PARK HWA-SUN

KR12 patents
⚠️ This page may combine multiple inventors who share the name “PARK HWA-SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

3 patents
US7886414B2Feb 15, 2011

Method of manufacturing capacitor-embedded PCB

SAMSUNG ELECTRO MECH7 citations83
US7730612B2Jun 8, 2010

Method of manufacturing component-embedded printed circuit board

SAMSUNG ELECTRO MECH7 citations73
US7328504B2Feb 12, 2008

Method for manufacturing circuit board with built-in electronic components

SAMSUNG ELECTRO MECH0 citations51

UNIV SUNGKYUNKWAN RES & BUS

2 patents
US9136455B2Sep 15, 2015

Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof

UNIV SUNGKYUNKWAN RES & BUS0 citations45
US9356005B2May 31, 2016

Package of light emitting diode with heat sink

UNIV SUNGKYUNKWAN RES & BUS0 citations35

JEONG JIN-SOO

1 patent
US8633397B2Jan 21, 2014

Method of processing cavity of core substrate

JEONG JIN-SOO40 citations90

KIM MOON-IL

1 patent
US8482890B2Jul 9, 2013

PCB strip and manufacturing method for electronic component embedded PCB

KIM MOON-IL6 citations67

KIM WOON-CHUN

1 patent
US8302270B2Nov 6, 2012

Method of manufacturing capacitor-embedded PCB

KIM WOON-CHUN3 citations61

KOREA INST SCI & TECH

1 patent
US7037739B2May 2, 2006

Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency

KOREA INST SCI & TECH2 citations61

SUH SU JEONG

1 patent
US9000593B2Apr 7, 2015

Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof

SUH SU JEONG2 citations53

BYUN JUNG-SOO

1 patent
US8618421B2Dec 31, 2013

Electronics component embedded PCB

BYUN JUNG-SOO2 citations53

PARK HWA SUN

1 patent
US8166653B2May 1, 2012

Method of manufacturing printed circuit board having embedded resistors

PARK HWA SUN2 citations52